ADSP-21369BSWZ-2A Analog Devices Inc, ADSP-21369BSWZ-2A Datasheet - Page 56

333 MHz, Shared Memory,S/PDIF EPAD PBfr

ADSP-21369BSWZ-2A

Manufacturer Part Number
ADSP-21369BSWZ-2A
Description
333 MHz, Shared Memory,S/PDIF EPAD PBfr
Manufacturer
Analog Devices Inc
Series
SHARC®r
Type
Floating Pointr
Datasheet

Specifications of ADSP-21369BSWZ-2A

Interface
DAI, DPI
Clock Rate
333MHz
Non-volatile Memory
ROM (768 kB)
On-chip Ram
256kB
Voltage - I/o
3.30V
Voltage - Core
1.20V
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
208-LQFP
Device Core Size
32/40Bit
Architecture
Super Harvard
Format
Floating Point
Clock Freq (max)
333MHz
Mips
333
Device Input Clock Speed
333MHz
Ram Size
256KB
Program Memory Size
768KB
Operating Supply Voltage (typ)
1.2/3.3V
Operating Supply Voltage (min)
1.14/3.13V
Operating Supply Voltage (max)
1.26/3.47V
Operating Temp Range
-40C to 85C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
208
Package Type
LQFP EP
Package
208LQFP EP
Numeric And Arithmetic Format
Floating-Point
Maximum Speed
333 MHz
Device Million Instructions Per Second
333 MIPS
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
ADSP-21369BSWZ-2A
Manufacturer:
Analog Devices Inc
Quantity:
10 000
ADSP-21367/ADSP-21368/ADSP-21369
PACKAGE DIMENSIONS
The ADSP-21367/ADSP-21368/ADSP-21369 processors are
available in 256-ball RoHS compliant and leaded BGA_ED, and
208-lead RoHS compliant LQFP_EP packages.
1.45
1.40
1.35
0.15
0.10
0.05
ROTATED 90° CCW
COPLANARITY
VIEW A
0.08
1.00 REF
SEATING
PLANE
0.75
0.60
0.45
0.20
0.15
0.09
3.5°
1.60 MAX
Figure 50. 208-Lead Low Profile Quad Flat Package, Exposed Pad [LQFP_EP]
NOTE:
THE EXPOSED PAD IS REQUIRED TO BE ELECTRICALLY AND THERMALLY CONNECTED TO VSS.
THIS SHOULD BE IMPLEMENTED BY SOLDERING THE EXPOSED PAD TO A VSS PCB LAND THAT IS THE SAME SIZE
AS THE EXPOSED PAD. THE VSS PCB LAND SHOULD BE ROBUSTLY CONNECTED TO THE VSS PLANE IN THE PCB
WITH AN ARRAY OF THERMAL VIAS FOR BEST PERFORMANCE.
VIEW A
52
1
208
53
PIN 1
30.20
30.00 SQ
29.80
COMPLIANT TO JEDEC STANDARDS MS-026-BJB-HD
Rev. E | Page 56 of 60 | July 2009
Dimensions shown in millimeters
(PINS DOWN)
TOP VIEW
(SW-208-1)
28.10
28.00 SQ
27.90
157
104
156
105
156
105
157
104
LEAD PITCH
BSC
0.50
BOTTOM VIEW
8.712
EXPOSED
REF
(PINS UP)
PAD
0.27
0.22
0.17
25.50
REF
53
208
52
1
8.890
REF

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