AD9775BSVZ Analog Devices Inc, AD9775BSVZ Datasheet - Page 9

• Manufacturer Part Number: AD9775BSVZ
• Description: IC,D/A CONVERTER,DUAL,14-BIT,CMOS,TQFP,80PIN
• Manufacturer: Analog Devices Inc
• Series: TxDAC+®r

Specifications of AD9775BSVZ

• Settling Time: 11ns
• Number Of Bits: 14
• Data Interface: Parallel
• Number Of Converters: 2
• Voltage Supply Source: Analog and Digital
• Power Dissipation (max): 410mW
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 80-TQFP Exposed Pad, 80-eTQFP, 80-HTQFP, 80-VQFP
• Number Of Channels: 2
• Resolution: 14b
• Interface Type: Parallel
• Single Supply Voltage (typ): 3.3V
• Dual Supply Voltage (typ): Not RequiredV
• Architecture: R-2R
• Power Supply Requirement: Analog and Digital
• Output Type: Current
• Single Supply Voltage (min): 3.1V
• Single Supply Voltage (max): 3.5V
• Dual Supply Voltage (min): Not RequiredV
• Dual Supply Voltage (max): Not RequiredV
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 80
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: AD9775-EBZ - BOARD EVALUATION FOR AD9775
• Lead Free Status / Rohs Status: Compliant

ABSOLUTE MAXIMUM RATINGS
Table 7.
Parameter
AVDD, DVDD, CLKVDD
AVDD, DVDD, CLKVDD
AGND, DGND, CLKGND
REFIO, FSADJ1/FSADJ2
I
P1B13 to P1B0, P2B13 to P2B0, RESET
DATACLK, PLL_LOCK
CLK+, CLK–
LPF
SPI_CSB, SPI_CLK, SPI_SDIO, SPI_SDO
Junction Temperature
Storage Temperature
Lead Temperature (10 sec)
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
ESD CAUTION
OUTA
, I
OUTB
With Respect To
AGND, DGND, CLKGND
AVDD, DVDD, CLKVDD
AGND, DGND, CLKGND
AGND
AGND
DGND
DGND
CLKGND
CLKGND
DGND
Rev. E | Page 9 of 56
THERMAL RESISTANCE
θ
soldered in a circuit board for surface-mount packages.
Table 8. Thermal Resistance
Package Type
80-Lead Thin Quad Flat Package
(TQFP_EP), Exposed Pad
JA
is specified for the worst-case conditions, that is, a device
Rating
−0.3 V to +4.0 V
−4.0 V to +4.0 V
−0.3 V to +0.3 V
−0.3 V to AVDD + 0.3 V
−1.0 V to AVDD + 0.3 V
−0.3 V to DVDD + 0.3 V
−0.3 V to DVDD + 0.3 V
−0.3 V to CLKVDD + 0.3 V
−0.3 V to CLKVDD + 0.3 V
−0.3 V to DVDD + 0.3 V
125°C
−65°C to +150°C
300°C
θ
23.5
JA
Unit
°C/W
AD9775