AD9775BSVZ Analog Devices Inc, AD9775BSVZ Datasheet - Page 9

IC,D/A CONVERTER,DUAL,14-BIT,CMOS,TQFP,80PIN

AD9775BSVZ

Manufacturer Part Number
AD9775BSVZ
Description
IC,D/A CONVERTER,DUAL,14-BIT,CMOS,TQFP,80PIN
Manufacturer
Analog Devices Inc
Series
TxDAC+®r
Datasheet

Specifications of AD9775BSVZ

Settling Time
11ns
Number Of Bits
14
Data Interface
Parallel
Number Of Converters
2
Voltage Supply Source
Analog and Digital
Power Dissipation (max)
410mW
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
80-TQFP Exposed Pad, 80-eTQFP, 80-HTQFP, 80-VQFP
Number Of Channels
2
Resolution
14b
Interface Type
Parallel
Single Supply Voltage (typ)
3.3V
Dual Supply Voltage (typ)
Not RequiredV
Architecture
R-2R
Power Supply Requirement
Analog and Digital
Output Type
Current
Single Supply Voltage (min)
3.1V
Single Supply Voltage (max)
3.5V
Dual Supply Voltage (min)
Not RequiredV
Dual Supply Voltage (max)
Not RequiredV
Operating Temp Range
-40C to 85C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
80
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
AD9775-EBZ - BOARD EVALUATION FOR AD9775
Lead Free Status / Rohs Status
Compliant

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ABSOLUTE MAXIMUM RATINGS
Table 7.
Parameter
AVDD, DVDD, CLKVDD
AVDD, DVDD, CLKVDD
AGND, DGND, CLKGND
REFIO, FSADJ1/FSADJ2
I
P1B13 to P1B0, P2B13 to P2B0, RESET
DATACLK, PLL_LOCK
CLK+, CLK–
LPF
SPI_CSB, SPI_CLK, SPI_SDIO, SPI_SDO
Junction Temperature
Storage Temperature
Lead Temperature (10 sec)
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
ESD CAUTION
OUTA
, I
OUTB
With Respect To
AGND, DGND, CLKGND
AVDD, DVDD, CLKVDD
AGND, DGND, CLKGND
AGND
AGND
DGND
DGND
CLKGND
CLKGND
DGND
Rev. E | Page 9 of 56
THERMAL RESISTANCE
θ
soldered in a circuit board for surface-mount packages.
Table 8. Thermal Resistance
Package Type
80-Lead Thin Quad Flat Package
(TQFP_EP), Exposed Pad
JA
is specified for the worst-case conditions, that is, a device
Rating
−0.3 V to +4.0 V
−4.0 V to +4.0 V
−0.3 V to +0.3 V
−0.3 V to AVDD + 0.3 V
−1.0 V to AVDD + 0.3 V
−0.3 V to DVDD + 0.3 V
−0.3 V to DVDD + 0.3 V
−0.3 V to CLKVDD + 0.3 V
−0.3 V to CLKVDD + 0.3 V
−0.3 V to DVDD + 0.3 V
125°C
−65°C to +150°C
300°C
θ
23.5
JA
Unit
°C/W
AD9775

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