SMAX-624CG-ACTEL Actel, SMAX-624CG-ACTEL Datasheet - Page 20

• Manufacturer Part Number: SMAX-624CG-ACTEL
• Description: Programming Socket Adapters & Emulators SILICON SCULPTOR ADAPTER MODULE
• Manufacturer: Actel

Specifications of SMAX-624CG-ACTEL

• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Evaluating Power in SX Devices
A critical element of system reliability is the ability of
electronic devices to safely dissipate the heat generated
during operation. The thermal characteristics of a circuit
depend on the device and package used, the operating
temperature, the operating current, and the system's
ability to dissipate heat.
You should complete a power evaluation early in the
design process to help identify potential heat-related
problems in the system and to prevent the system from
exceeding the device’s maximum allowed junction
temperature.
The actual power dissipated by most applications is
significantly lower than the power the package can
dissipate. However, a thermal analysis should be
performed for all projects. To perform a power
evaluation, follow these steps:
Estimating Power Consumption
The total power dissipation for the SX family is the sum
of the DC power dissipation and the AC power
dissipation. Use
consumption of your application.
DC Power Dissipation
The power due to standby current is typically a small
component of the overall power. The Standby power is
shown
conditions (70°C).
Table 1-12 • Standby Power
The DC power dissipation is defined in
1 -1 6
I
4 mA
CC
SX Family FPGAs
1. Estimate
2. Calculate the maximum power allowed for the
3. Compare the estimated power and maximum
P
P
(I
Total
DC
standby
application.
device and package.
power values.
= (I
= P
in
) × V
standby
DC
Table 1-12
+ P
CCI
) × V
EQ 1-5
AC
+ xV
the
V
3.6 V
CC
CCA
OL
to calculate the estimated power
power
+ (I
× I
for
OL
standby
+ y(V
commercial,
) × V
consumption
CCI
Power
14.4 mW
CCR
– V
EQ
OH
+
1-6.
) × V
worst-case
OH
of
EQ 1-5
EQ 1-6
the
v3.2
AC Power Dissipation
The power dissipation of the SX Family is usually
dominated by the dynamic power dissipation. Dynamic
power dissipation is a function of frequency, equivalent
capacitance, and power supply voltage. The AC power
dissipation is defined in
Definition of Terms Used in Formula
m
n
p
q
q
x
y
r
r
s
C
C
C
C
C
C
C
f
f
f
f
f
f
1
2
1
m
n
p
q1
q2
s1
1
2
EQM
EQI
EQO
EQCR
EQHV
EQHF
L
P
P
P
(n × C
(0.5 × (q
(0.5 × (q2 × CEQCR × f
(0.5 × (s
AC
AC
Output Buffer
= Number of logic modules switching at f
= Number of input buffers switching at f
= Number of output buffers switching at f
= Number of clock loads on the first routed array
= Number of clock loads on the second routed array
= Number of I/Os at logic low
= Number of I/Os at logic high
= Fixed capacitance due to first routed array clock
= Fixed capacitance due to second routed array
= Number of clock loads on the dedicated array
= Equivalent capacitance of logic modules in pF
= Equivalent capacitance of input buffers in pF
= Equivalent capacitance of output buffers in pF
= Equivalent capacitance of routed array clock in pF
= Variable capacitance of dedicated array clock
= Fixed capacitance of dedicated array clock
= Output lead capacitance in pF
= Average logic module switching rate in MHz
= Average input buffer switching rate in MHz
= Average output buffer switching rate in MHz
= Average first routed array clock rate in MHz
= Average second routed array clock rate in MHz
= Average dedicated array clock rate in MHz
= P
= V
EQI
clock
clock
clock
clock
Module
CCA
1
1
× f
× C
× C
2
n
)
+ P
× [(m × C
Input Buffer
EQHV
EQCR
+ P
Input Buffer
RCLKA Net
× f
× f
s1
q1
+ (p × (C
EQM
EQ 1-7
q2
) + (C
) + (r
)+ (r2 × f
+ P
× f
1
EQHF
RCLKB Net
m
× f
and
EQO
)
Module
q1
× f
q2
+ C
))
EQ
))RCLKB +
RCLKA
s1
))
L
1-8.
+
+ P
) × f
HCLK
HCLK Net
+
p
)
]
Output Buffer
n
m
p
+
EQ 1-7
EQ 1-8
+