H11A817B3SD Fairchild Semiconductor, H11A817B3SD Datasheet - Page 10

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H11A817B3SD

Manufacturer Part Number
H11A817B3SD
Description
Transistor Output Optocouplers Optocoupler SM-DIP4 Phototransistor
Manufacturer
Fairchild Semiconductor
Datasheet

Specifications of H11A817B3SD

Maximum Fall Time
18 us
Maximum Input Diode Current
50 mA
Maximum Reverse Diode Voltage
6 V
Maximum Rise Time
18 us
Output Device
Phototransistor
Output Type
DC
Configuration
1 Channel
Input Type
DC
Maximum Collector Emitter Voltage
70 V
Maximum Collector Emitter Saturation Voltage
0.2 V
Isolation Voltage
5000 Vrms
Current Transfer Ratio
260 %
Maximum Forward Diode Voltage
1.5 V
Maximum Collector Current
50 mA
Maximum Power Dissipation
200 mW
Maximum Operating Temperature
+ 100 C
Minimum Operating Temperature
- 55 C
Package / Case
PDIP-4 Gull Wing
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
H11AA814 Series, H11A617 Series, H11A817 Series Rev. 1.0.8
Lead Free Recommended IR Reflow Condition
Recommended Wave Soldering condition
Profile Feature
Preheat condition
(Tsmin-Tsmax / ts)
Melt soldering zone
Peak temperature (Tp)
Ramp-down rate
Profile Feature
Peak temperature (Tp)
Tsmax
Tsmin
25°C
Tp
ts (Preheat)
Pb-Sn solder assembly
100°C ~ 150°C
6°C/sec max.
60 ~ 120 sec
60 ~ 120 sec
240 +0/-5°C
183°C
10
Time (sec)
For all solder assembly
Max 260°C for 10 sec
Soldering zon
Lead Free assembly
150°C ~ 200°C
6°C/sec max.
60 ~120 sec
260 +0/-5°C
30 ~ 90 sec
Ramp-down
217°C
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