658-60ABT1E Wakefield Thermal Solutions, 658-60ABT1E Datasheet - Page 9

• Manufacturer Part Number: 658-60ABT1E
• Description: Pin Fin Heat Sink For BGA Packages And PowerPC
• Manufacturer: Wakefield Thermal Solutions

Specifications of 658-60ABT1E

• Product: Heatsinks
• Mounting Style: SMD/SMT
• Heatsink Material: Aluminum
• Dimensions: 27.9 mm L x 27.9 mm W x 15.2 mm H
• Designed For: BGA, Super BGA, PBGA, FPBGA, PowerPC
• Color: Black
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant

HEAT SINKS FOR BGAs, SUPER BGAs, PBGAs, and FPBGAs
Designed to fit a .063” thick PCB
electronic package thickness of .110”
See 609 Series for PCB hole layout for clip attachment
DIM.
“A”
619 95 AB 124 D1 S3
2.808
Thermal Interface Material Option
Blank
S5
S6
S3
S4
5
4
3
2
1
0
*Performance is for shrouded conditions. 609-100
will perform better than 609-50 in cases with bypass.
Bergquist Qpad 3
Bergquist Softface
Chomerics T710
Chomerics T443
*
609-100AB
100
None
609-50AB
AIR VELOCITY (LFM)
200
300
400
500