658-60ABT1E Wakefield Thermal Solutions, 658-60ABT1E Datasheet - Page 8

• Manufacturer Part Number: 658-60ABT1E
• Description: Pin Fin Heat Sink For BGA Packages And PowerPC
• Manufacturer: Wakefield Thermal Solutions

Specifications of 658-60ABT1E

• Product: Heatsinks
• Mounting Style: SMD/SMT
• Heatsink Material: Aluminum
• Dimensions: 27.9 mm L x 27.9 mm W x 15.2 mm H
• Designed For: BGA, Super BGA, PBGA, FPBGA, PowerPC
• Color: Black
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant

DELTEM
1 0 0
8 0
6 0
4 0
2 0
™
0
0
0
COMPOSITE HEAT SINKS FOR BGAs
200
0.25
HEAT DISSIPATED (WATTS)
AIR VELOCITY (LFM)
Available with pressure sensitive adhesives for quick and easy mounting. See Page 3
Available with pressure sensitive adhesives for quick and easy mounting. See Page 3
400
0.50
600
0.75
800
1.00
1000
1.25
3 0
2 5
2 0
1 5
1 0
5
0
1 0 0
8 0
6 0
4 0
2 0
0
0
0
200
0.25
HEAT DISSIPATED (WATTS)
AIR VELOCITY (LFM)
400
0.50
600
0.75
800
1.00
1000
1.25
1 6
1 4
1 2
1 0
8
6
4
2
0