658-60ABT1E Wakefield Thermal Solutions, 658-60ABT1E Datasheet - Page 7

• Manufacturer Part Number: 658-60ABT1E
• Description: Pin Fin Heat Sink For BGA Packages And PowerPC
• Manufacturer: Wakefield Thermal Solutions

Specifications of 658-60ABT1E

• Product: Heatsinks
• Mounting Style: SMD/SMT
• Heatsink Material: Aluminum
• Dimensions: 27.9 mm L x 27.9 mm W x 15.2 mm H
• Designed For: BGA, Super BGA, PBGA, FPBGA, PowerPC
• Color: Black
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant

HEAT SINKS FOR BGAs, SUPER BGAs, PBGAs, and FPBGAs
2. Optional factory preapplied pressure-sensitive adhesive. See Page 3
PRODUCT FEATURES
919541 Series Heat Sink Thermal Performance
10
9
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2
1
0
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100
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Approach Air Velocity, LFM
Performance shown is with S5 interface material applied.