658-60ABT1E Wakefield Thermal Solutions, 658-60ABT1E Datasheet - Page 13

• Manufacturer Part Number: 658-60ABT1E
• Description: Pin Fin Heat Sink For BGA Packages And PowerPC
• Manufacturer: Wakefield Thermal Solutions

Specifications of 658-60ABT1E

• Product: Heatsinks
• Mounting Style: SMD/SMT
• Heatsink Material: Aluminum
• Dimensions: 27.9 mm L x 27.9 mm W x 15.2 mm H
• Designed For: BGA, Super BGA, PBGA, FPBGA, PowerPC
• Color: Black
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant

HEAT SINKS FOR BGAs, SUPER BGAs, PBGAs, and FPBGAs
3
2
1
0
7
6
5
4
3
2
1
0
4
3
2
1
0
100
100
100
7
6
5
4
3
2
1
0
6
5
4
3
2
1
0
100
100
200
200
200
200
200
300
300
300
AIR VELOCITY (LFM)
AIR VELOCITY (LFM)
AIR VELOCITY (LFM)
300
300
AIR VELOCITY (LFM)
AIR VELOCITY (LFM)
400
400
400
400
400
500
500
500
500
500
600
600
600
600
600
700
700
700
700
700
3
2
1
0
1