658-60ABT1E Wakefield Thermal Solutions, 658-60ABT1E Datasheet - Page 10

• Manufacturer Part Number: 658-60ABT1E
• Description: Pin Fin Heat Sink For BGA Packages And PowerPC
• Manufacturer: Wakefield Thermal Solutions

Specifications of 658-60ABT1E

• Product: Heatsinks
• Mounting Style: SMD/SMT
• Heatsink Material: Aluminum
• Dimensions: 27.9 mm L x 27.9 mm W x 15.2 mm H
• Designed For: BGA, Super BGA, PBGA, FPBGA, PowerPC
• Color: Black
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant

HEAT SINKS FOR BGAs, SUPER BGAs, PBGAs, and FPBGAs
7
6
5
4
3
2
1
0
8
7
6
5
100
200
300
AIR VELOCITY (LFM)
400
500
600
700
14
12
10
8
6
4
2
0
100
7
6
5
4
3
2
1
0
8
7
6
5
4
3
2
1
0
7
6
5
4
3
2
1
0
7
6
5
100
100
100
7
6
5
4
3
2
1
0
200
200
200
200
300
AIR VELOCITY (LFM)
300
300
300
AIR VELOCITY (LFM)
AIR VELOCITY (LFM)
AIR VELOCITY (LFM)
604-40AB
604-60AB
400
400
400
400
500
500
500
500
600
600
600
600
700
700
700
700
14
12
10
8
6
4
2
0
100
7
6
5
4
3
2
1
0
10
100
9
8
7
6
5
4
3
2
1
0
100
8
7
6
5
4
3
2
200