BLF6G10LS-160RN:11 NXP Semiconductors, BLF6G10LS-160RN:11 Datasheet - Page 10
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BLF6G10LS-160RN:11
Manufacturer Part Number
BLF6G10LS-160RN:11
Description
BLF6G10LS-160RN/LDMOST/REEL13/
Manufacturer
NXP Semiconductors
Datasheet
1.BLF6G10LS-160RN11.pdf
(11 pages)
Specifications of BLF6G10LS-160RN:11
Transistor Type
LDMOS
Frequency
922.5MHz
Gain
22.5dB
Voltage - Rated
65V
Current Rating
39A
Current - Test
1.2A
Voltage - Test
32V
Power - Output
32W
Package / Case
SOT502B
Channel Type
N
Channel Mode
Enhancement
Continuous Drain Current
39A
Drain Source Voltage (max)
65V
Output Power (max)
32W
Power Gain (typ)@vds
22.5@32VdB
Frequency (min)
920MHz
Frequency (max)
960MHz
Package Type
LDMOST
Pin Count
3
Forward Transconductance (typ)
13.5S
Drain Source Resistance (max)
70(Typ)@6.15Vmohm
Reverse Capacitance (typ)
4.2@32VpF
Operating Temp Range
-65C to 225C
Drain Efficiency (typ)
27%
Mounting
Surface Mount
Mode Of Operation
2-Carrier W-CDMA
Number Of Elements
1
Vswr (max)
10
Screening Level
Military
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Noise Figure
-
Lead Free Status / Rohs Status
Compliant
Other names
934063282118
NXP Semiconductors
12. Legal information
12.1 Data sheet status
[1]
[2]
[3]
12.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
12.3 Disclaimers
General — Information in this document is believed to be accurate and
reliable. However, NXP Semiconductors does not give any representations or
warranties, expressed or implied, as to the accuracy or completeness of such
information and shall have no liability for the consequences of use of such
information.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
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space or life support equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
13. Contact information
For more information, please visit:
For sales office addresses, please send an email to:
BLF6G10-160RN_10LS-160RN_2
Product data sheet
Document status
Objective [short] data sheet
Preliminary [short] data sheet
Product [short] data sheet
Please consult the most recently issued document before initiating or completing a design.
The term ‘short data sheet’ is explained in section “Definitions”.
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
[1][2]
Product status
Development
Qualification
Production
[3]
http://www.nxp.com
This document contains data from the preliminary specification.
This document contains the product specification.
Definition
This document contains data from the objective specification for product development.
Rev. 02 — 21 January 2010
salesaddresses@nxp.com
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) may cause permanent
damage to the device. Limiting values are stress ratings only and operation of
the device at these or any other conditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may affect device reliability.
Terms and conditions of sale — NXP Semiconductors products are sold
subject to the general terms and conditions of commercial sale, as published
at http://www.nxp.com/profile/terms, including those pertaining to warranty,
intellectual property rights infringement and limitation of liability, unless
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of
any inconsistency or conflict between information in this document and such
terms and conditions, the latter will prevail.
No offer to sell or license — Nothing in this document may be interpreted or
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conveyance or implication of any license under any copyrights, patents or
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Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
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12.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
BLF6G10(LS)-160RN
Power LDMOS transistor
© NXP B.V. 2010. All rights reserved.
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