PIC16F872-E/SO Microchip Technology, PIC16F872-E/SO Datasheet - Page 154

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PIC16F872-E/SO

Manufacturer Part Number
PIC16F872-E/SO
Description
IC,MICROCONTROLLER,8-BIT,PIC CPU,CMOS,SOP,28PIN,PLASTIC
Manufacturer
Microchip Technology
Series
PIC® 16Fr

Specifications of PIC16F872-E/SO

Rohs Compliant
YES
Core Processor
PIC
Core Size
8-Bit
Speed
20MHz
Connectivity
I²C, SPI
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
22
Program Memory Size
3.5KB (2K x 14)
Program Memory Type
FLASH
Eeprom Size
64 x 8
Ram Size
128 x 8
Voltage - Supply (vcc/vdd)
4 V ~ 5.5 V
Data Converters
A/D 5x10b
Oscillator Type
External
Operating Temperature
-40°C ~ 125°C
Package / Case
28-SOIC (7.5mm Width)
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
PIC16F872
28-Lead Skinny Plastic Dual In-line (SP) – 300 mil Body (PDIP)
DS30221C-page 152
Note:
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimension D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side.
JEDEC Equivalent: MO-095
Drawing No. C04-070
Number of Pins
Pitch
Top to Seating Plane
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing
Mold Draft Angle Top
Mold Draft Angle Bottom
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
n
eB
E1
E
2
1
Dimension Limits
c
D
§
A1
A
Units
A2
eB
A1
E1
B1
D
n
p
A
E
L
B
c
MIN
1.345
.140
.125
.015
.300
.275
.125
.008
.040
.016
.320
5
5
B
B1
INCHES*
NOM
28
1.365
.100
.150
.130
.310
.285
.130
.012
.053
.019
.350
10
10
MAX
1.385
.160
.135
.325
.295
.135
.015
.065
.430
.022
15
15
MIN
34.16
3.56
3.18
0.38
7.62
6.99
3.18
0.20
1.02
8.13
0.41
5
5
MILLIMETERS
© 2006 Microchip Technology Inc.
p
NOM
28
34.67
2.54
3.30
7.87
7.24
3.30
0.29
1.33
0.48
8.89
3.81
10
10
A2
L
MAX
35.18
10.92
4.06
3.43
8.26
7.49
3.43
0.38
1.65
0.56
15
15

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