HY27UF082G2B-TPCB HYNIX SEMICONDUCTOR, HY27UF082G2B-TPCB Datasheet - Page 52

• Manufacturer Part Number: HY27UF082G2B-TPCB
• Description: IC, MEMORY, FLASH NAND 2GB, TSOP48
• Manufacturer: HYNIX SEMICONDUCTOR

Specifications of HY27UF082G2B-TPCB

• Access Time: 20ns
• Supply Voltage Range: 2.7V To 3.6V
• Memory Case Style: TSOP
• No. Of Pins: 48
• Operating Temperature Range: 0°C To +70°C
• Package / Case: TSOP
• Base Number: 27
• Interface: Serial
• Logic: RoHS Compliant
• Memory Type: Flash - NAND
• Memory Configuration: 256M X 8
• Rohs Compliant: Yes

Rev 0.2 / Jan. 2008
NOTE: Drawing is not to scale.
Table 25: 63-ball FBGA - 9 x 11 ball array 0.8mm pitch, Pakage Mechanical Data
Symbol
FD1
FE1
D1
D2
SD
A1
A2
E1
E2
FD
FE
SE
A
b
D
E
e
Figure 38: 63-ball FBGA - 9 x 11 ball array 0.8mm pitch, Pakage Outline
10.90
0.80
0.25
0.55
0.40
8.90
Min
Millimeters
11.00
2Gbit (256Mx8bit) NAND Flash
0.90
0.30
0.60
0.45
9.00
4.00
7.20
5.60
8.80
0.80
2.50
0.90
2.70
1.10
0.40
0.40
Typ
HY27UF(08/16)2G2B Series
11.10
Max
1.00
0.35
0.65
0.50
9.10
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