HY27UF082G2B-TPCB HYNIX SEMICONDUCTOR, HY27UF082G2B-TPCB Datasheet - Page 24

IC, MEMORY, FLASH NAND 2GB, TSOP48

HY27UF082G2B-TPCB

Manufacturer Part Number
HY27UF082G2B-TPCB
Description
IC, MEMORY, FLASH NAND 2GB, TSOP48
Manufacturer
HYNIX SEMICONDUCTOR
Datasheet

Specifications of HY27UF082G2B-TPCB

Access Time
20ns
Supply Voltage Range
2.7V To 3.6V
Memory Case Style
TSOP
No. Of Pins
48
Operating Temperature Range
0°C To +70°C
Package / Case
TSOP
Base Number
27
Interface
Serial
Logic
RoHS Compliant
Memory Type
Flash - NAND
Memory Configuration
256M X 8
Rohs Compliant
Yes

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Part Number:
HY27UF082G2B-TPCB
Quantity:
8
Rev 0.2 / Jan. 2008
(Without Spare Area)
(Without Spare Area)
Between multiple chips
Serial Access Time
(Byte / 512Byte)
Programmed Pages
Interleave program
Spare Area Size
Organization
Simultaneously
Die / Package
Block Size
Page Size
Write Cache
Number of
Cell Type
Table 18: 4th Byte of Device Identifier Description
Table 17: 3rd Byte of Device Idendifier Description
1KB
2KB
4KB
8KB
8
16
50ns
30ns
25ns
Reserved
64K
128K
256K
512KB
X8
X16
1
2
4
8
2 Level Cell
4 Level Cell
8 Level Cell
16 Level Cell
1
2
4
8
Not
Supported
Not
Supported
Description
Description
IO7
0
0
1
1
IO7
0
1
IO6
0
1
IO6
0
1
IO5-4
2Gbit (256Mx8bit) NAND Flash
0 0
0 1
1 0
1 1
HY27UF(08/16)2G2B Series
IO5 IO4
0 0
0 1
1 0
1 1
IO3
0
1
0
1
IO3 IO2
0 0
0 1
1 0
1 1
IO2
0
1
IO1 IO0
IO1-0
0 0
0 1
1 0
1 1
0 0
0 1
1 0
1 1
24

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