PCA9555PW NXP Semiconductors, PCA9555PW Datasheet - Page 30

• Manufacturer Part Number: PCA9555PW
• Description: IC, I2C-BUS AND SMBUS I/O PORT, TSSOP24
• Manufacturer: NXP Semiconductors

Specifications of PCA9555PW

• Chip Configuration: 16 Bit
• Bus Frequency: 400kHz
• Ic Interface Type: I2C
• No. Of I/o's: 16
• Supply Voltage Range: 2.3V To 5.5V
• Digital Ic Case Style: TSSOP
• No. Of Pins: 24
• Termination Type: SMD
• Filter Terminals: SMD
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

NXP Semiconductors
16. Soldering of through-hole mount packages
PCA9555_8
Product data sheet
16.1 Introduction to soldering through-hole mount packages
16.2 Soldering by dipping or by solder wave
16.3 Manual soldering
For further information on temperature profiles, refer to Application Note AN10365
“Surface mount reflow soldering description” .
This text gives a very brief insight into wave, dip and manual soldering.
Wave soldering is the preferred method for mounting of through-hole mount IC packages
on a printed-circuit board.
Driven by legislation and environmental forces the worldwide use of lead-free solder
pastes is increasing. Typical dwell time of the leads in the wave ranges from
3 seconds to 4 seconds at 250 C or 265 C, depending on solder material applied, SnPb
or Pb-free respectively.
The total contact time of successive solder waves must not exceed 5 seconds.
The device may be mounted up to the seating plane, but the temperature of the plastic
body must not exceed the specified maximum storage temperature (T
printed-circuit board has been pre-heated, forced cooling may be necessary immediately
after soldering to keep the temperature within the permissible limit.
Apply the soldering iron (24 V or less) to the lead(s) of the package, either below the
seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is
less than 300 C it may remain in contact for up to 10 seconds. If the bit temperature is
between 300 C and 400 C, contact may be up to 5 seconds.
Fig 32. Temperature profiles for large and small components
temperature
MSL: Moisture Sensitivity Level
Rev. 08 — 22 October 2009
= minimum soldering temperature
maximum peak temperature
minimum peak temperature
= MSL limit, damage level
16-bit I
2
C-bus and SMBus I/O port with interrupt
temperature
peak
stg(max)
PCA9555
© NXP B.V. 2009. All rights reserved.
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