MCP23S08-E/ML Microchip Technology, MCP23S08-E/ML Datasheet - Page 37
![IC, I/O EXPANDER, 8BIT, 10MHZ, QFN-20](/photos/6/64/66481/c04-126_ml_sml.jpg)
MCP23S08-E/ML
Manufacturer Part Number
MCP23S08-E/ML
Description
IC, I/O EXPANDER, 8BIT, 10MHZ, QFN-20
Manufacturer
Microchip Technology
Datasheet
1.MCP23008-EP.pdf
(44 pages)
Specifications of MCP23S08-E/ML
Chip Configuration
8 Bit
Bus Frequency
10MHz
Ic Interface Type
SPI
No. Of I/o's
8
Supply Voltage Range
1.8V To 5.5V
Digital Ic Case Style
QFN
No. Of Pins
20
Interface
SPI
Number Of I /o
8
Interrupt Output
Yes
Frequency - Clock
10MHz
Voltage - Supply
1.8 V ~ 5.5 V
Operating Temperature
-40°C ~ 125°C
Mounting Type
Surface Mount
Package / Case
20-VQFN Exposed Pad, 20-HVQFN, 20-SQFN, 20-DHVQFN
Includes
POR
Interface Type
SPI
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
GPIODM-KPLCD - BOARD DEMO LCD GPIO EXP KEYPAD
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MCP23S08-E/ML
Manufacturer:
Microchip
Quantity:
1 800
Company:
Part Number:
MCP23S08-E/ML
Manufacturer:
MICROCHIP
Quantity:
2 100
Part Number:
MCP23S08-E/ML
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
© 2007 Microchip Technology Inc.
20-Lead Plastic Shrink Small Outline (SS) – 5.30 mm Body [SSOP]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.20 mm per side.
3. Dimensioning and tolerancing per ASME Y14.5M.
Note:
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
NOTE 1
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
A
A1
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff
Overall Width
Molded Package Width
Overall Length
Foot Length
Footprint
Lead Thickness
Foot Angle
Lead Width
N
1 2
b
D
Dimension Limits
e
A2
E1
Units
A2
A1
E1
L1
D
N
A
E
e
L
c
b
MCP23008/MCP23S08
E
c
MIN
1.65
0.05
7.40
5.00
6.90
0.55
0.09
0.22
0°
–
L1
MILLIMETERS
0.65 BSC
1.25 REF
NOM
1.75
7.80
5.30
7.20
0.75
20
4°
–
–
–
–
Microchip Technology Drawing C04-072B
MAX
2.00
1.85
8.20
5.60
7.50
0.95
0.25
0.38
8°
–
DS21919E-page 37
L