MCP23S08-E/ML Microchip Technology, MCP23S08-E/ML Datasheet - Page 34
![IC, I/O EXPANDER, 8BIT, 10MHZ, QFN-20](/photos/6/64/66481/c04-126_ml_sml.jpg)
MCP23S08-E/ML
Manufacturer Part Number
MCP23S08-E/ML
Description
IC, I/O EXPANDER, 8BIT, 10MHZ, QFN-20
Manufacturer
Microchip Technology
Datasheet
1.MCP23008-EP.pdf
(44 pages)
Specifications of MCP23S08-E/ML
Chip Configuration
8 Bit
Bus Frequency
10MHz
Ic Interface Type
SPI
No. Of I/o's
8
Supply Voltage Range
1.8V To 5.5V
Digital Ic Case Style
QFN
No. Of Pins
20
Interface
SPI
Number Of I /o
8
Interrupt Output
Yes
Frequency - Clock
10MHz
Voltage - Supply
1.8 V ~ 5.5 V
Operating Temperature
-40°C ~ 125°C
Mounting Type
Surface Mount
Package / Case
20-VQFN Exposed Pad, 20-HVQFN, 20-SQFN, 20-DHVQFN
Includes
POR
Interface Type
SPI
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
GPIODM-KPLCD - BOARD DEMO LCD GPIO EXP KEYPAD
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MCP23S08-E/ML
Manufacturer:
Microchip
Quantity:
1 800
Company:
Part Number:
MCP23S08-E/ML
Manufacturer:
MICROCHIP
Quantity:
2 100
Part Number:
MCP23S08-E/ML
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
MCP23008/MCP23S08
DS21919E-page 34
18-Lead Plastic Dual In-Line (P) – 300 mil Body [PDIP]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
Note:
NOTE 1
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
A
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
A1
Number of Pins
Pitch
Top to Seating Plane
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing §
1
N
2
b
b1
3
D
Dimension Limits
Units
e
A2
A1
E1
eB
b1
N
D
A
E
b
e
L
c
E1
A2
.015
.300
.240
.880
.008
.045
.014
MIN
.115
.115
–
–
L
.100 BSC
INCHES
NOM
.130
.310
.250
.900
.130
.010
.060
.018
18
–
–
–
Microchip Technology Drawing C04-007B
© 2007 Microchip Technology Inc.
E
eB
MAX
.210
.195
.325
.280
.920
.150
.014
.070
.022
.430
–
c