MCP23S08-E/ML Microchip Technology, MCP23S08-E/ML Datasheet - Page 30

• Manufacturer Part Number: MCP23S08-E/ML
• Description: IC, I/O EXPANDER, 8BIT, 10MHZ, QFN-20
• Manufacturer: Microchip Technology

Specifications of MCP23S08-E/ML

• Chip Configuration: 8 Bit
• Bus Frequency: 10MHz
• Ic Interface Type: SPI
• No. Of I/o's: 8
• Supply Voltage Range: 1.8V To 5.5V
• Digital Ic Case Style: QFN
• No. Of Pins: 20
• Interface: SPI
• Number Of I /o: 8
• Interrupt Output: Yes
• Frequency - Clock: 10MHz
• Voltage - Supply: 1.8 V ~ 5.5 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 20-VQFN Exposed Pad, 20-HVQFN, 20-SQFN, 20-DHVQFN
• Includes: POR
• Interface Type: SPI
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: GPIODM-KPLCD - BOARD DEMO LCD GPIO EXP KEYPAD
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant

MCP23008/MCP23S08
TABLE 2-3:
FIGURE 2-7:
DS21919E-page 30
SPI Interface AC Characteristics
Note 1:
Param
12
No.
10
11
13
14
9
(2)
SCL/SCK
Register
2:
Loaded
SDA/SI
Output
Input
GPn
GPn
INT
Clock Low Time
Clock Delay Time
Clock Enable Time
Output Valid from Clock Low
Output Hold Time
Output Disable Time
Pin
Pin
Pin
This parameter is characterized, not 100% tested.
T
In
V
= 90 ns (max) when address pointer rolls over from address 0x0A to 0x00.
Characteristic
SPI INTERFACE AC CHARACTERISTICS (CONTINUED)
GPIO AND INT TIMING
D1
INT pin active
LSb of data byte zero
during a write or read
command, depending
on parameter.
Operating Conditions (unless otherwise indicated):
1.8V ≤ V
4.5V ≤ V
Sym
T
T
T
T
T
CLD
CLE
T
DIS
HO
LO
V
D0
DD
DD
≤ 5.5V at -40°C ≤ T
≤ 5.5V at -40°C ≤ T
Min
90
45
45
50
50
—
—
—
—
0
51
50
Typ
—
—
—
—
—
—
—
—
—
—
Max
100
inactive
90
45
45
—
—
—
—
—
—
A
A
≤ +125°C (E-Temp) (Note 1)
≤ +85°C (I-Temp)
53
52
Units
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
1.8V – 5.5V (I-Temp)
2.7V – 5.5V (I-Temp)
4.5V – 5.5V (E-Temp)
1.8V – 5.5V (I-Temp)
2.7V – 5.5V (I-Temp)
4.5V – 5.5V (E-Temp)
© 2007 Microchip Technology Inc.
Conditions