LIS3LV02DLTR STMicroelectronics, LIS3LV02DLTR Datasheet - Page 19

• Manufacturer Part Number: LIS3LV02DLTR
• Description: IC MEMS INERTL SENSOR 3AX LGA16
• Manufacturer: STMicroelectronics

Specifications of LIS3LV02DLTR

• Featured Product: STM32 Cortex-M3 Companion Products
• Axis: X, Y, Z
• Acceleration Range: ±2g, 6g
• Sensitivity: 1024LSB/g, 340LSB/g
• Voltage - Supply: 2.16 V ~ 3.6 V
• Output Type: Digital
• Bandwidth: 40Hz ~ 2.56kHz Selectable
• Interface: I²C, SPI
• Mounting Type: Surface Mount
• Package / Case: 16-LGA
• Family Name: LIS3LV02DL
• Package Type: LGA
• Operating Supply Voltage (min): 2.16V
• Operating Supply Voltage (typ): 3.3V
• Operating Supply Voltage (max): 3.6V
• Operating Temperature (min): -40C
• Operating Temperature (max): 85C
• Operating Temperature Classification: Industrial
• Product Depth (mm): 4.4mm
• Product Length (mm): 7.5mm
• Mounting: Surface Mount
• Pin Count: 16
• Sensing Axis: X, Y, Z
• Acceleration: 2 g, 6 g
• Digital Output - Number Of Bits: 12 bit, 16 bit
• Supply Voltage (max): 3.6 V
• Supply Voltage (min): 2.16 V
• Supply Current: 0.65 mA
• Maximum Operating Temperature: + 85 C
• Minimum Operating Temperature: - 40 C
• Digital Output - Bus Interface: I2C, SPI
• For Use With: 497-8261 - BOARD EVAL BASED ON LIS3LV02DL497-5069 - EVAL BOARD 3AXIS MEMS ACCELLRMTR
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 497-8415-2; LIS3LV02DLTR

LIS3LV02DL
3
3.1
3.2
Functionality
The LIS3LV02DL is a high performance, low-power, digital output 3-axis linear
accelerometer packaged in an LGA package. The complete device includes a sensing
element and an IC interface able to take the information from the sensing element and to
provide a signal to the external world through an I
Sensing element
A proprietary process is used to create a surface micro-machined accelerometer. The
technology allows to carry out suspended silicon structures which are attached to the
substrate in a few points called anchors and are free to move in the direction of the sensed
acceleration. To be compatible with the traditional packaging techniques a cap is placed on
top of the sensing element to avoid blocking the moving parts during the moulding phase of
the plastic encapsulation.
When an acceleration is applied to the sensor the proof mass displaces from its nominal
position, causing an imbalance in the capacitive half-bridge. This imbalance is measured
using charge integration in response to a voltage pulse applied to the sense capacitor.
At steady state the nominal value of the capacitors are few pF and when an acceleration is
applied the maximum variation of the capacitive load is up to 100fF.
IC interface
The complete measurement chain is composed by a low-noise capacitive amplifier which
converts into an analog voltage the capacitive unbalancing of the MEMS sensor and by
three Σ∆ analog-to-digital converters, one for each axis, that translate the produced signal
into a digital bitstream.
The Σ∆ converters are coupled with dedicated reconstruction filters which remove the high
frequency components of the quantization noise and provide low rate and high resolution
digital words.
The charge amplifier and the Σ∆ converters are operated respectively at 61.5 kHz and
20.5 kHz.
The data rate at the output of the reconstruction depends on the user selected Decimation
Factor (DF) and spans from 40 Hz to 2560 Hz.
The acceleration data may be accessed through an I
device particularly suitable for direct interfacing with a microcontroller.
The LIS3LV02DL features a Data-Ready signal (RDY) which indicates when a new set of
measured acceleration data is available thus simplifying data synchronization in digital
system employing the device itself.
The LIS3LV02DL may also be configured to generate an inertial Wake-Up, Direction
Detection and Free-Fall interrupt signal accordingly to a programmed acceleration event
along the enabled axes.
2
C/SPI serial interface.
2
C/SPI interface thus making the
Functionality
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