MCB1114 Keil, MCB1114 Datasheet - Page 3

• Manufacturer Part Number: MCB1114
• Description: BOARD EVALUATION FOR NXP LPC1114
• Manufacturer: Keil

Specifications of MCB1114

• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

NXP Semiconductors
Table 1.
LPC1111_12_13_14_0
Objective data sheet
Type number
LPC1114FHN33/201
LPC1114FHN33/301
LPC1113FBD48/301
LPC1114FBD48/301
LPC1114FA44/301
Ordering information
4.1 Ordering options
Table 2.
Type number
LPC1111
LPC1111FHN33/101
LPC1111FHN33/201
LPC1112
LPC1112FHN33/101
LPC1112FHN33/201
LPC1113
LPC1113FHN33/201
LPC1113FHN33/301
LPC1113FBD48/301
LPC1114
LPC1114FHN33/201
LPC1114FHN33/301
LPC1114FBD48/301
LPC1114FA44/301
Package
Name
HVQFN33
HVQFN33
LQFP48
LQFP48
PLCC44
…continued
Ordering options
LQFP48: plastic low profile quad flat package; 48 leads; body 7 x 7 x
LQFP48: plastic low profile quad flat package; 48 leads; body 7 x 7 x
Description
HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7 x 7 x 0.85 mm
HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7 x 7 x 0.85 mm
1.4 mm
1.4 mm
PLCC44; plastic leaded chip carrier; 44 leads
Rev. 00.11 — 13 November 2009
Flash
8 kB
8 kB
16 kB
16 kB
24 kB
24 kB
24 kB
32 kB
32 kB
32 kB
32 kB
Total
SRAM
2 kB
4 kB
2 kB
4 kB
4 kB
8 kB
8 kB
4 kB
8 kB
8 kB
8 kB
UART
RS-485
1
1
1
1
1
1
1
1
1
1
1
I
Fast+
1
1
1
1
1
1
1
1
1
1
1
2
C/
LPC1111/12/13/14
1
1
1
1
1
1
2
1
1
2
2
SPI
ADC
channels
8
8
8
8
8
8
8
8
8
8
8
© NXP B.V. 2009. All rights reserved.
Package
HVQFN33
HVQFN33
HVQFN33
HVQFN33
HVQFN33
HVQFN33
LQFP48
HVQFN33
HVQFN33
LQFP48
PLCC44
Version
n/a
n/a
sot313-2
sot313-2
sot187-2
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