MCB1114 Keil, MCB1114 Datasheet - Page 2

• Manufacturer Part Number: MCB1114
• Description: BOARD EVALUATION FOR NXP LPC1114
• Manufacturer: Keil

Specifications of MCB1114

• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

NXP Semiconductors
3. Applications
4. Ordering information
Table 1.
LPC1111_12_13_14_0
Objective data sheet
Type number
LPC1111FHN33/101
LPC1111FHN33/201
LPC1112FHN33/101
LPC1112FHN33/201
LPC1113FHN33/201
LPC1113FHN33/301
Ordering information
Package
Name
HVQFN33
HVQFN33
HVQFN33
HVQFN33
HVQFN33
HVQFN33
Integrated PMU (Power Management Unit) to minimize power consumption during
Sleep, Deep-sleep, and Deep power-down modes.
Three reduced power modes: Sleep, Deep-sleep, and Deep power-down.
Single 3.3 V power supply (1.8 V to 3.6 V).
10-bit ADC with input multiplexing among 8 pins.
GPIO pins can be used as edge and level sensitive interrupt sources.
Clock output function with divider that can reflect the system oscillator clock, IRC
clock, CPU clock, and the Watchdog clock.
Processor wake-up from Deep-sleep mode via a dedicated start logic using up to 13 of
the functional pins.
Brownout detect with four separate thresholds for interrupt and one threshold for
forced reset.
Power-On Reset (POR).
Crystal oscillator with an operating range of 1 MHz to 25 MHz.
12 MHz internal RC oscillator trimmed to 1 % accuracy that can optionally be used as
a system clock.
PLL allows CPU operation up to the maximum CPU rate without the need for a
high-frequency crystal. May be run from the main oscillator, the internal RC oscillator,
or the watchdog oscillator.
Available as 48-pin LQFP package, 33-pin HVQFN package, and 44-pin PLCC
package.
eMetering
Lighting
Industrial networking
Alarm systems
White goods
Description
HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7 x 7 x 0.85 mm
HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7 x 7 x 0.85 mm
HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7 x 7 x 0.85 mm
HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7 x 7 x 0.85 mm
HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7 x 7 x 0.85 mm
HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7 x 7 x 0.85 mm
Rev. 00.11 — 13 November 2009
LPC1111/12/13/14
© NXP B.V. 2009. All rights reserved.
Version
n/a
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