FPF1039UCX Fairchild Semiconductor, FPF1039UCX Datasheet - Page 14

Power Switch ICs - Power Distribution Low On-Res SlewRate Cntrlld Load Switch

FPF1039UCX

Manufacturer Part Number
FPF1039UCX
Description
Power Switch ICs - Power Distribution Low On-Res SlewRate Cntrlld Load Switch
Manufacturer
Fairchild Semiconductor
Datasheet

Specifications of FPF1039UCX

On Resistance (max)
21 mOhms
Maximum Operating Temperature
+ 85 C
Minimum Operating Temperature
- 40 C
Maximum Power Dissipation
1.2 W
Mounting Style
SMD/SMT
Off Time (max)
32 ms
On Time (max)
4.4 ms
Supply Current
5.5 uA
Supply Voltage (max)
5.5 V
Supply Voltage (min)
1.2 V
Switch Current (typ)
2 A
Package / Case
WLCSP-6
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
FPF1039UCX
Quantity:
30 000
© 2010 Fairchild Semiconductor Corporation
FPF1038 / FPF1039 • Rev. 1.0.0
Physical Dimensions
Product-Specific Dimensions
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or
obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the
warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/.
FPF1038UCX
FPF1039UCX
Product
INDEX AREA
2X
BALL A1
1.00
0.03 C
0.05 C
BOTTOM VIEW
0.50
0.50
C
Figure 40.
TOP VIEW
1 2
E
1.5mm+/-0.03
C
B
A
SEATING PLANE
(X) ±0.018
A
6 Ball, 1.0 x 1.5mm Wafer-Level Chip-Scale Packaging (WLCSP)
D
0.625
0.539
Ø0.315 +/- .025
6X
D
B
(Y) ±0.018
2X
0.06 C
F
0.005
0.03 C
E
F
C A B
D
1.0mm+/-0.03
SIDE VIEWS
NOTES:
E
14
B. DIMENSIONS ARE IN MILLIMETERS.
C. DIMENSIONS AND TOLERANCE
D. DATUM C IS DEFINED BY THE SPHERICAL
E. PACKAGE NOMINAL HEIGHT IS 582 MICRONS
F. FOR DIMENSIONS D, E, X, AND Y SEE
G. DRAWING FILNAME: MKT-UC006AFrev2.
A. NO JEDEC REGISTRATION APPLIES.
SOLDER MASK
±43 MICRONS (539-625 MICRONS).
PER ASMEY14.5M, 1994.
CROWNS OF THE BALLS.
OPENING
PRODUCT DATASHEET.
(Ø0.350)
RECOMMENDED LAND PATTERN
(NSMD PAD TYPE)
A1
0.240mm
X
(0.50)
0.332±0.018
(1.00)
0.250±0.025
(Ø0.250)
Cu Pad
0.240mm
www.fairchildsemi.com
Y

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