A54SX08A-TQG100 Actel, A54SX08A-TQG100 Datasheet - Page 28
![FPGA - Field Programmable Gate Array 12K System Gates](/photos/16/14/161495/tqfp-100_sml.jpg)
A54SX08A-TQG100
Manufacturer Part Number
A54SX08A-TQG100
Description
FPGA - Field Programmable Gate Array 12K System Gates
Manufacturer
Actel
Datasheet
1.A54SX08A-TQG100.pdf
(108 pages)
Specifications of A54SX08A-TQG100
Processor Series
A54SX08
Core
IP Core
Number Of Macrocells
512
Maximum Operating Frequency
350 MHz
Number Of Programmable I/os
130
Delay Time
4 ns to 8.4 ns
Supply Voltage (max)
5.25 V
Maximum Operating Temperature
+ 70 C
Minimum Operating Temperature
0 C
Development Tools By Supplier
Silicon-Explorer II, Silicon-Sculptor 3, SI-EX-TCA
Mounting Style
SMD/SMT
Supply Voltage (min)
2.25 V
Number Of Gates
8000
Package / Case
TQFP-100
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
A54SX08A-TQG100
Manufacturer:
Microsemi SoC
Quantity:
10 000
Part Number:
A54SX08A-TQG100
Manufacturer:
MICROSEMI/美高森美
Quantity:
20 000
Company:
Part Number:
A54SX08A-TQG100A
Manufacturer:
Microsemi SoC
Quantity:
10 000
Company:
Part Number:
A54SX08A-TQG100I
Manufacturer:
Microsemi SoC
Quantity:
10 000
Power Dissipation
A critical element of system reliability is the ability of electronic devices to safely dissipate the heat generated during
operation. The thermal characteristics of a circuit depend on the device and package used, the operating temperature,
the operating current, and the system's ability to dissipate heat.
A complete power evaluation should be performed early in the design process to help identify potential heat-related
problems in the system and to prevent the system from exceeding the device’s maximum allowed junction
temperature.
The actual power dissipated by most applications is significantly lower than the power the package can dissipate.
However, a thermal analysis should be performed for all projects. To perform a power evaluation, follow these steps:
1. Estimate the power consumption of the application.
2. Calculate the maximum power allowed for the device and package.
3. Compare the estimated power and maximum power values.
Estimating Power Dissipation
The total power dissipation for the SX-A family is the sum of the DC power dissipation and the AC power dissipation:
DC Power Dissipation
The power due to standby current is typically a small component of the overall power. An estimation of DC power
dissipation under typical conditions is given by:
Note: For other combinations of temperature and voltage settings, refer to the
Calculator.
AC Power Dissipation
The power dissipation of the SX-A family is usually dominated by the dynamic power dissipation. Dynamic power
dissipation is a function of frequency, equivalent capacitance, and power supply voltage. The AC power dissipation is
defined as follows:
or:
2 -8
P
AC
SX-A Family FPGAs
=
+ (0.5 * (q
(C
V
CCA
EQHF
2
* f
* [(m * C
s1
1
))
* C
HCLK
EQCR
EQCM
]
P
* f
AC
* fm)
q1
= P
) + (r
C-cells
C-cells
1
* f
+ P
+ (m * C
q1
R-cells
))
CLKA
+ P
EQSM
+ (0.5 * (q
CLKA
P
DC
P
* fm)
Total
+ P
= I
Standby
CLKB
= P
R-cells
v5.3
2
DC
* C
+ P
+ (n * C
+ P
* V
EQCR
HCLK
AC
CCA
* f
+ P
EQI
q2
Output Buffer
)+ (r
* f
n
2
)
Input Buffer
* f
q2
+ P
))
CLKB
Input Buffer
+ (p * (C
eX, SX-A and RT54SX-S Power
+ (0.5 * (s
EQO
1
+ C
* C
L
EQHV
) * f
p
)
* f
Output Buffer
s1
) +
EQ 2-5
EQ 2-6
EQ 2-7
EQ 2-8