PCA9501D,118 NXP Semiconductors, PCA9501D,118 Datasheet - Page 23

• Manufacturer Part Number: PCA9501D,118
• Description: I/O Expanders, Repeaters & Hubs 8BIT I2C FMQB GPIONT PU2K EPR
• Manufacturer: NXP Semiconductors
• Series: -r

Specifications of PCA9501D,118

• Logic Family: PCA9501
• Number Of Lines (input / Output): 8.0 / 8.0
• Operating Supply Voltage: 2.5 V to 3.6 V
• Power Dissipation: 400 mW
• Operating Temperature Range: - 40 C to + 85 C
• Input Voltage: 5 V
• Logic Type: I/O Expander
• Maximum Clock Frequency: 400 KHz
• Mounting Style: SMD/SMT
• Number Of Input Lines: 8.0
• Number Of Output Lines: 8.0
• Output Current: 25 mA
• Output Voltage: 5 V
• Package / Case: SO-20
• Mounting Type: Surface Mount
• Voltage - Supply: 2.5 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C
• Interface: I²C, SMBus
• Number Of I /o: 8
• Frequency - Clock: 400kHz
• Interrupt Output: Yes
• Includes: EEPROM
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: OM6285 - EVAL BOARD I2C-2002-1A568-4002 - DEMO BOARD I2C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 935272364118 PCA9501D-T

NXP Semiconductors
PCA9501_4
Product data sheet
14.4 Reflow soldering
Key characteristics in reflow soldering are:
Table 8.
Table 9.
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see
Package thickness (mm)
< 2.5
Package thickness (mm)
< 1.6
1.6 to 2.5
> 2.5
•
•
•
2.5
Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see
reducing the process window
Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 8
SnPb eutectic process (from J-STD-020C)
Lead-free process (from J-STD-020C)
and
Figure
9
Rev. 04 — 10 February 2009
8-bit I
29.
Package reflow temperature ( C)
Volume (mm
< 350
235
220
Package reflow temperature ( C)
Volume (mm
< 350
260
260
250
2
C-bus and SMBus I/O port with interrupt, 2-kbit EEPROM
3
3
)
)
Figure
350 to 2000
260
250
245
29) than a SnPb process, thus
220
220
350
> 2000
260
245
245
PCA9501
© NXP B.V. 2009. All rights reserved.
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