TGF2021-01 TriQuint, TGF2021-01 Datasheet - Page 8

• Manufacturer Part Number: TGF2021-01
• Description: RF GaAs DC-12GHz 1mm Pwr pHEMT (0.35um)
• Manufacturer: TriQuint

Specifications of TGF2021-01

• Mounting Style: SMD/SMT
• Forward Transconductance Gfs (max / Min): 375 mS
• Gate-source Breakdown Voltage: - 8 V
• Package / Case: SMD/SMT
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 1031674

TriQuint Semiconductor Texas: Phone [phone] Fax [phone] [e-mail] www.triquint.com
GaAs MMIC devices are susceptible to damage from Electrostatic Discharge. Proper precautions should be observed during
handing, assembly and test.
0.530 [0.021]
0.248 [0.010]
0.000 [0.000]
Units: millimeters (inches)
Chip edge to bond pad dimensions are shown to center of bond pad
Chip size tolerance: +/- 0.051 (0.002)
GND IS BACKSIDE OF MMIC
Bond pad #1
Bond pad #2
Thickness: 0.100 (0.004)
Mechanical Drawing
1
NE
(Vg)
(Vd)
0.090 x 0.090 (0.004 x 0.004)
0.090 x 0.090 (0.004 x 0.004)
RC
B
2
RC
B
Product Datasheet
0.248 [0.010]
TGF2021-01
August 7, 2007
Rev -
8