TGF2021-04 TriQuint, TGF2021-04 Datasheet
TGF2021-04
Specifications of TGF2021-04
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TGF2021-04 Summary of contents
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... GHz Discrete power pHEMT Product Description The TriQuint TGF2021- discrete 4 mm pHEMT which operates from DC-12 GHz. The TGF2021-04 is designed using TriQuint’s proven standard 0.35um power pHEMT production process. The TGF2021-04 typically provides > 36 dBm of saturated output power with power gain of 11 dB. The maximum power ...
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... Note: For TriQuint’s 0.35um power pHEMT devices, RF breakdown >> DC breakdown TriQuint Semiconductor: Phone (972)994-8465 Fax (972)994-8504 Info-mmw@tqs.com www.triquint.com TABLE I MAXIMUM RATINGS TABLE °C, Nominal Minimum Typical - 1200 - 1500 -1.35 -1 -30 - -30 - Product Datasheet August 7, 2007 TGF2021-04 Value Notes dBm 2/ See note 150 °C 4/ 320 °C -65 to 150 °C Maximum Unit - ...
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... Nominal 10V Idq = 300mA 36 0.852 ∠ 1725 36 59 11.5 0.879 ∠ 167.5 TABLE IV THERMAL INFORMATION Test Conditions Idq = 300 mA Pdiss = 3.6 W Product Datasheet August 7, 2007 TGF2021- 12V UNITS Idq = 300mA 37.5 dBm 0.849 ∠ 170.7 - 36.7 dBm 0.874 ∠ 166.3 - θ ...
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... Product Datasheet August 7, 2007 TGF2021-04 L Drain Unit pHEMT cell Reference Plane Source Drain UPC Source Vd = 10V Vd = 12V UNITS Idq = 100mA Idq = 75mA 0.450 0.45 0.160 0.19 ...
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... Linear Model for 4mm pHEMT 4 Gate Pads (4x TriQuint Semiconductor: Phone (972)994-8465 Fax (972)994-8504 Info-mmw@tqs.com www.triquint.com Product Datasheet L - via = 0.0135 nH (5x) 5 UPC Drain Pads (4x) 6 UPC 7 UPC 8 UPC August 7, 2007 TGF2021-04 5 Rev - ...
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... Product Datasheet August 7, 2007 TGF2021-04 s12 ang s22 s22 ang deg dB deg 15.89 -6.160 -161.81 7.33 -5.842 -168.07 4.06 -5.709 -169.15 2.20 -5.581 -168.96 ...
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... Bond pads # 5-8: (Drain) 0.090 x 0.090 (0.004 x 0.004) GaAs MMIC devices are susceptible to damage from Electrostatic Discharge. Proper precautions should be observed during handing, assembly and test. TriQuint Semiconductor: Phone (972)994-8465 Fax (972)994-8504 Info-mmw@tqs.com www.triquint.com Mechanical Drawing (Gate) 0.090 x 0.090 (0.004 x 0.004) Product Datasheet August 7, 2007 TGF2021-04 DRAIN Rev - 7 ...
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... Force, time, and ultrasonics are critical parameters. • Aluminum wire should not be used. • Devices with small pad sizes should be bonded with 0.0007-inch wire. • Maximum stage temperature is 200 °C. TriQuint Semiconductor: Phone (972)994-8465 Fax (972)994-8504 Info-mmw@tqs.com www.triquint.com Assembly Process Notes Product Datasheet August 7, 2007 TGF2021-04 8 Rev - ...