S9S08DN32F1MLC Freescale Semiconductor, S9S08DN32F1MLC Datasheet - Page 193

• Manufacturer Part Number: S9S08DN32F1MLC
• Description: IC MCU 8BIT 32KB FLASH 32LQFP
• Manufacturer: Freescale Semiconductor
• Series: HCS08r

Specifications of S9S08DN32F1MLC

• Core Processor: HCS08
• Core Size: 8-Bit
• Speed: 40MHz
• Connectivity: I²C, LIN, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number Of I /o: 25
• Program Memory Size: 32KB (32K x 8)
• Program Memory Type: FLASH
• Eeprom Size: 1K x 8
• Ram Size: 1.5K x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 10x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 32-LQFP
• Processor Series: S08D
• Core: HCS08
• Data Bus Width: 8 bit
• Data Ram Size: 1 KB
• Interface Type: I2C, SCI, SPI
• Maximum Clock Frequency: 40 MHz
• Number Of Programmable I/os: 26
• Operating Supply Voltage: 3 V to 5 V
• Maximum Operating Temperature: + 125 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWS08
• Development Tools By Supplier: DEMO9S08DZ60
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 12 bit, 10 Channel
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Chapter 11
Inter-Integrated Circuit (S08IICV2)
11.1
The inter-integrated circuit (IIC) provides a method of communication between a number of devices. The
interface is designed to operate up to 100 kbps with maximum bus loading and timing. The device is
capable of operating at higher baud rates, up to a maximum of clock/20, with reduced bus loading. The
maximum communication length and the number of devices that can be connected are limited by a
maximum bus capacitance of 400 pF.
All MC9S08DN60 Series MCUs feature the IIC, as shown in the following block diagram.
Freescale Semiconductor
Introduction
Drive strength must be disabled (DSE=0) for the IIC pins when using the
IIC module for correct operation.
MC9S08DN60 Series Data Sheet, Rev 3
NOTE
193