SX1212IWLTRT Semtech, SX1212IWLTRT Datasheet - Page 2

• Manufacturer Part Number: SX1212IWLTRT
• Description: IC TXRX 300MHZ-510MHZ 32-TQFN
• Manufacturer: Semtech

Specifications of SX1212IWLTRT

• Frequency: 300MHz ~ 510MHz
• Data Rate - Maximum: 150kbps
• Modulation Or Protocol: FSK, OOK
• Applications: AMR, ISM, Home Automation, Process Control
• Power - Output: 12.5dBm
• Sensitivity: -110dBm
• Voltage - Supply: 2.1 V ~ 3.6 V
• Current - Receiving: 3mA
• Current - Transmitting: 25mA
• Data Interface: PCB, Surface Mount
• Antenna Connector: PCB, Surface Mount
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 32-TQFN
• Operating Temperature (min): -40C
• Operating Temperature (max): 85C
• Operating Temperature Classification: Industrial
• Modulation Type: FSK/OOK
• Package Type: TQFN EP
• Operating Supply Voltage (min): 2.1V
• Operating Supply Voltage (typ): 2.5/3.3V
• Operating Supply Voltage (max): 3.6V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Memory Size: -
• Lead Free Status / Rohs Status: Supplier Unconfirmed
• Other names: SX1212IWLTR

Table of Contents
1. General Description ................................................................... 5
2. Electrical Characteristics............................................................ 8
3. Architecture Description ........................................................... 12
4. Operating Modes...................................................................... 33
5. Data Processing....................................................................... 34
Rev 2 – June 18th, 2009
ADVANCED COMMUNICATIONS & SENSING
1.1. Simplified Block Diagram................................................... 5
1.2. Pin Diagram ....................................................................... 6
1.3. Pin Description................................................................... 7
2.1. ESD Notice ........................................................................ 8
2.2. Absolute Maximum Ratings ............................................... 8
2.3. Operating Range ............................................................... 8
2.4. Chip Specification .............................................................. 8
3.1. Power Supply Strategy .................................................... 12
3.2. Frequency Synthesis Description .................................... 13
3.3. Transmitter Description ................................................... 18
3.4. Receiver Description........................................................ 23
4.1. Modes of Operation ......................................................... 33
4.2. Digital Pin Configuration vs. Chip Mode .......................... 33
5.1. Overview.......................................................................... 34
5.2. Control Block Description ................................................ 35
2.4.1. Power Consumption .................................................. 8
2.4.2. Frequency Synthesis................................................. 9
2.4.3. Transmitter ................................................................ 9
2.4.4. Receiver .................................................................. 10
2.4.5. Digital Specification ................................................. 11
3.2.1. Reference Oscillator................................................ 13
3.2.2. CLKOUT Output ...................................................... 13
3.2.3. PLL Architecture...................................................... 14
3.2.4. PLL Tradeoffs.......................................................... 14
3.2.5. Voltage Controlled Oscillator................................... 15
3.2.6. PLL Loop Filter ........................................................ 16
3.2.7. PLL Lock Detection Indicator .................................. 16
3.2.8. Frequency Calculation ............................................ 16
3.3.1. Architecture Description .......................................... 18
3.3.2. Bit Rate Setting ....................................................... 19
3.3.3. Alternative Settings ................................................. 19
3.3.4. Fdev Setting in FSK Mode ...................................... 19
3.3.5. Fdev Setting in OOK Mode ..................................... 19
3.3.6. Interpolation Filter ................................................... 20
3.3.7. Power Amplifier ....................................................... 20
3.3.8. Common Input and Output Front-End..................... 22
3.4.1. Architecture ............................................................. 23
3.4.2. LNA and First Mixer ................................................ 24
3.4.3. IF Gain and Second I/Q Mixer................................. 24
3.4.4. Channel Filters ........................................................ 24
3.4.5. Channel Filters Setting in FSK Mode ...................... 25
3.4.6. Channel Filters Setting in OOK Mode ..................... 26
3.4.7. RSSI ........................................................................ 26
3.4.8. Fdev Setting in Receive Mode ................................ 28
3.4.9. FSK Demodulator.................................................... 28
3.4.10. OOK Demodulator................................................. 28
3.4.11. Bit Synchronizer .................................................... 31
3.4.12. Alternative Settings ............................................... 32
3.4.13. Data Output ........................................................... 32
5.1.1. Block Diagram ......................................................... 34
5.1.2. Data Operation Modes ............................................ 34
5.2.1. SPI Interface ........................................................... 35
5.2.2. FIFO ........................................................................ 38
5.2.3. Sync Word Recognition........................................... 39
5.2.4. Packet Handler........................................................ 40
Page 2 of 77
6. Configuration and Status Registers ..........................................58
7. Application Information .............................................................66
8. Packaging Information ..............................................................75
9. Revision History ........................................................................77
10. Contact Information.................................................................77
5.3. Continuous Mode .............................................................41
5.4. Buffered Mode ..................................................................44
5.5. Packet Mode.....................................................................49
6.1. General Description..........................................................58
6.2. Main Configuration Register - MCParam..........................58
6.3. Interrupt Configuration Parameters - IRQParam ..............60
6.4. Receiver Configuration parameters - RXParam ...............62
6.5. Sync Word Parameters - SYNCParam.............................63
6.6. Transmitter Parameters - TXParam .................................64
6.7. Oscillator Parameters - OSCParam .................................64
6.8. Packet Handling Parameters – PKTParam ......................65
7.1. Crystal Resonator Specification .......................................66
7.2. Software for Frequency Calculation .................................66
7.3. Switching Times and Procedures .....................................66
7.4. Reset of the Chip..............................................................72
7.5. Reference Design.............................................................73
8.1. Package Outline Drawing .................................................75
8.2. PCB Land Pattern.............................................................75
8.3. Tape & Reel Specification ................................................76
5.2.5. Control......................................................................40
5.3.1. General Description .................................................41
5.3.2. Tx Processing ..........................................................41
5.3.3. Rx Processing ..........................................................42
5.3.4. Interrupt Signals Mapping ........................................42
5.3.5. uC Connections........................................................43
5.3.6. Continuous Mode Example ......................................43
5.4.1. General Description .................................................44
5.4.2. Tx Processing ..........................................................44
5.4.3. Rx Processing ..........................................................45
5.4.4. Interrupt Signals Mapping ........................................46
5.4.5. uC Connections........................................................47
5.4.6. Buffered Mode Example...........................................47
5.5.1. General Description .................................................49
5.5.2. Packet Format..........................................................49
5.5.3. Tx Processing ..........................................................51
5.5.4. Rx Processing ..........................................................51
5.5.5. Packet Filtering ........................................................52
5.5.6. DC-Free Data Mechanisms......................................53
5.5.7. Interrupt Signal Mapping ..........................................54
5.5.8. uC Connections........................................................55
5.5.9. Packet Mode Example .............................................56
5.5.10. Additional Information ............................................56
7.2.1. GUI ...........................................................................66
7.2.2. .dll for Automatic Production Bench .........................66
7.3.1. Optimized Receive Cycle .........................................67
7.3.2. Optimized Transmit Cycle ........................................68
7.3.3. Transmitter Frequency Hop Optimized Cycle ..........69
7.3.4. Receiver Frequency Hop Optimized Cycle ..............70
7.3.5. Rx Tx and Tx Rx Jump Cycles............................71
7.4.1. POR .........................................................................72
7.4.2. Manual Reset ...........................................................72
7.5.1. Application Schematic..............................................73
7.5.2. PCB Layout ..............................................................73
7.5.3. Bill Of Material..........................................................74
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