SI4330-B1-FMR Silicon Laboratories Inc, SI4330-B1-FMR Datasheet - Page 62
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SI4330-B1-FMR
Manufacturer Part Number
SI4330-B1-FMR
Description
IC RX ISM 240-960MHZ 20VQFN
Manufacturer
Silicon Laboratories Inc
Specifications of SI4330-B1-FMR
Frequency
240MHz ~ 960MHz
Sensitivity
-121dBm
Data Rate - Maximum
256 kbps
Modulation Or Protocol
FSK, GFSK, OOK
Applications
Remote Control, RKE, Security Systems
Current - Receiving
18.5mA
Data Interface
PCB, Surface Mount
Antenna Connector
PCB, Surface Mount
Features
RSSI Equipped
Voltage - Supply
1.8 V ~ 3.6 V
Operating Temperature
-40°C ~ 85°C
Package / Case
20-VQFN
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Memory Size
-
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
SI4330-B1-FMR
Manufacturer:
HIROSE
Quantity:
3 200
Part Number:
SI4330-B1-FMR
Manufacturer:
SILICON LABS/芯科
Quantity:
20 000
Si4330-B1
62
Notes: General
Note: Solder Mask Design
Notes: Stencil Design
Notes: Card Assembly
1. All dimensions shown are in millimeters (mm) unless otherwise noted.
2. This land pattern design is based on IPC-7351 guidelines.
1. All metal pads are to be non-solder mask defined (NSMD). Clearance
1. A stainless steel, laser-cut and electro-polished stencil with trapezoidal
2. The stencil thickness should be 0.125 mm (5 mils).
3. The ratio of stencil aperture to land pad size should be 1:1 for the
4. A 2x2 array of 1.10 x 1.10 mm openings on 1.30 mm pitch should be
1. A No-Clean, Type-3 solder paste is recommended.
2. The recommended card reflow profile is per the JEDEC/IPC J-STD-020
between the solder mask and the metal pad is to be 60 µm minimum, all
the way around the pad.
walls should be used to assure good solder paste release.
perimeter pads.
used for the center ground pad.
specification for small body components.
Symbol
C1
C2
X1
X2
Y1
Y2
E
Table 19. PCB Land Pattern Dimensions
Rev 1.0
3.90
3.90
0.20
2.65
0.65
2.65
Min
Millimeters
0.50 REF
Max
4.00
4.00
0.30
2.75
0.75
2.75