NCV8509PDW18R2G ON Semiconductor, NCV8509PDW18R2G Datasheet - Page 15

• Manufacturer Part Number: NCV8509PDW18R2G
• Description: IC REG VOLT DUAL SEQ LIN 16SOIC
• Manufacturer: ON Semiconductor

Specifications of NCV8509PDW18R2G

• Regulator Topology: Positive Fixed
• Voltage - Output: 3.3V, 1.8V
• Voltage - Input: Up to 50V
• Voltage - Dropout (typical): 0.4V @ 100mA
• Number Of Regulators: 2
• Current - Limit (min): 115mA, 105mA
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 16-SOIC (7.5mm Width) Exposed Pad, 16-eSOIC, 16-HSOIC
• Polarity: Positive
• Number Of Outputs: 2
• Output Type: Fixed
• Output Voltage: 1.8 V, 3.3 V
• Output Current: 0.115 A, 0.1 A
• Line Regulation: 50 mV
• Load Regulation: 50 mV
• Dropout Voltage (max): 0.2 V
• Input Voltage Max: 50 V
• Maximum Operating Temperature: + 125 C
• Minimum Operating Temperature: - 40 C
• Mounting Style: SMD/SMT
• Voltage Regulation Accuracy: 2 %
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Current - Output: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: NCV8509PDW18R2GOS

permissible value of R
package section of the data sheet. Those packages with
Once the value of P
The value of R
Figure 51. 16 Lead SOW (Exposed Pad), qJA as a
100
Thickness), Board Material = 0.0625, G−10/R−4
90
80
70
60
50
40
Function of the Pad Copper Area (2 oz. Cu
0
V
IN1
4.5 V
qJA
R qJA + 150C *
200
can then be compared with those in the
V IN1 t V REF ) V SAT
V IN2 + V IN1 * V SAT
qJA
Copper Area (mm
IC(max)
can be calculated:
Mode 1
P IC
400
is known, the maximum
T A
V
Max V
I(V
IN2
2
)
IN2
600
) × R
IN
Delta
EX
V REF ) V SAT t V IN1 t V REF ) (I OUT2
V IN2 + V REF
Figure 50. V
http://onsemi.com
800
(8)
Mode 2
15
Shunt On
IN
R
the die temperature below 150°C.
dissipate the heat generated by the IC, and an external
heatsink will be required.
Heat Sinks
package to improve the flow of heat away from the IC and
into the surrounding air.
outside environment will have a thermal resistance. Like
series electrical resistances, these resistances are summed to
determine the value of R
where:
R
functions of the package type, heatsink and the interface
between them. These values appear in heat sink data sheets
of heat sink manufacturers.
Shunt
qJA
qJA
In some cases, none of the packages will be sufficient to
A heat sink effectively increases the surface area of the
Each material in the heat flow path between the IC and the
R
R
R
R
qJC
qCS
qSA
qJC
’s less than the calculated value in equation 2 will keep
, it too is a function of package type. R
= the junction−to−case thermal resistance,
appears in the package section of the data sheet. Like
= the case−to−heatsink thermal resistance, and
= the heatsink−to−ambient thermal resistance.
R qJA + R qJC ) R qCS ) R qSA
V IN1 u V REF ) (I OUT2
V IN2 + V IN1 * (I OUT2
Mode 3
qJA
R EX )
:
Shunt Off
R EX )
R EX )
qCS
and R
qSA
are
(9)