NCP500SN50T1G ON Semiconductor, NCP500SN50T1G Datasheet - Page 19

• Manufacturer Part Number: NCP500SN50T1G
• Description: IC REG LDO 150MA 5.0V LN SOT23-5
• Manufacturer: ON Semiconductor

Specifications of NCP500SN50T1G

• Regulator Topology: Positive Fixed
• Voltage - Output: 5V
• Voltage - Input: Up to 6V
• Voltage - Dropout (typical): 0.12V @ 150mA
• Number Of Regulators: 1
• Current - Output: 150mA
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: TSOT-23-5, TSOT-5, TSOP-5
• Number Of Outputs: 1
• Polarity: Positive
• Input Voltage Max: 6 V
• Output Voltage: 5 V
• Output Type: Fixed
• Dropout Voltage (max): 0.01 V at 1 mA
• Output Current: 150 mA
• Line Regulation: 10 mV
• Load Regulation: 45 mV
• Voltage Regulation Accuracy: 2.5 %
• Maximum Operating Temperature: + 125 C
• Mounting Style: SMD/SMT
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Current - Limit (min): -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: NCP500SN50T1GOS

L1
6X
Bottom View
(Optional)
DETAIL A
0.10 C
0.05 C
2X
2X
0.08 C
0.10 C
REFERENCE
EDGE OF PACKAGE
A
NOTE 3
PIN ONE
6X
0.10 C
0.10 C
B
L
b1
Í Í Í
Í Í Í
Í Í Í
BOTTOM VIEW
SIDE VIEW
1
6
TOP VIEW
DETAIL B
MOLD CMPD
D
A1
4
A1
3
A3
É É É
É É É
b
Side View
(Optional)
DETAIL B
e
A
5X
DETAIL A
0.10 C
0.05 C
PACKAGE DIMENSIONS
A
D2
B
E
C
EXPOSED Cu
http://onsemi.com
DFN6 2x2.2 mm
CASE 488−03
SEATING
PLANE
A
NOTE 3
SQL SUFFIX
ISSUE G
NCP500
B
19
A3
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
0.016
0.40
0.020
0.50
NOTES:
SOLDERING FOOTPRINT*
1. DIMENSIONING AND TOLERANCING PER
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
4. COPLANARITY APPLIES TO THE EXPOSED
5. TERMINAL b MAY HAVE MOLD COMPOUND
6. DETAILS A AND B SHOW OPTIONAL VIEWS
ASME Y14.5M, 1994.
TERMINAL AND IS MEASURED BETWEEN
0.25 AND 0.30mm FROM TERMINAL.
PAD AS WELL AS THE TERMINALS.
MATERIAL ALONG SIDE EDGE.
FOR END OF TERMINAL LEAD AT EDGE OF
PACKAGE AND SIDE EDGE OF PACKAGE.
DIM
A1
A3
D2
b1
L1
A
D
b
E
e
L
MIN
0.80
0.00
0.20
0.30
0.40
0.30
0.00
0.075
1.9
MILLIMETERS
0.020
0.50
0.20 REF
2.00 BSC
2.20 BSC
0.65 BSC
NOM
0.90
0.03
0.25
0.35
0.50
0.35
0.05
MAX
1.00
0.05
0.30
0.40
0.60
0.40
0.10
SCALE 10:1
0.025
0.025
0.65
0.65