C8051F537-IM Silicon Laboratories Inc, C8051F537-IM Datasheet - Page 51
C8051F537-IM
Manufacturer Part Number
C8051F537-IM
Description
IC 8051 MCU 2K FLASH 20QFN
Manufacturer
Silicon Laboratories Inc
Series
C8051F53xr
Specifications of C8051F537-IM
Core Processor
8051
Core Size
8-Bit
Speed
25MHz
Connectivity
SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, Temp Sensor, WDT
Number Of I /o
16
Program Memory Size
2KB (2K x 8)
Program Memory Type
FLASH
Ram Size
256 x 8
Voltage - Supply (vcc/vdd)
2 V ~ 5.25 V
Data Converters
A/D 16x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Package / Case
20-QFN
Data Bus Width
8 bit
Data Ram Size
256 B
Interface Type
SPI, UART
Maximum Clock Frequency
25 MHz
Number Of Programmable I/os
16
Number Of Timers
3
Operating Supply Voltage
2.7 V to 5.25 V
Maximum Operating Temperature
+ 125 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 40 C
On-chip Adc
12 bit, 16 Channel
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Details
Other names
336-1400
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
C8051F537-IM
Manufacturer:
Silicon Labs
Quantity:
135
- Current page: 51 of 218
- Download datasheet (2Mb)
Table 3.9. QFN-20 Landing Diagram Dimensions
Notes:
General
Solder Mask Design
Stencil Design
Card Assembly
1. All dimensions shown are in millimeters (mm) unless otherwise
2. This land pattern design is based on the IPC-7351 guidelines.
3. All metal pads are to be non-solder mask defined (NSMD).
4. A stainless steel, laser-cut and electro-polished stencil with
5. The stencil thickness should be 0.125 mm (5 mils).
6. The ratio of stencil aperture to land pad size should be 1:1 for all
7. A 2x2 array of 1.10 x 1.10 mm openings on 1.30 mm pitch should be
8. A No-Clean, Type-3 solder paste is recommended.
9. The recommended card reflow profile is per the JEDEC/IPC J-STD-
Symbol
noted.
Clearance between the solder mask and the metal pad is to be
60 µm minimum, all the way around the pad.
trapezoidal walls should be used to assure good solder paste
release.
perimeter pads.
used for the center ground pad.
020 specification for Small Body Components.
C1
C2
X1
X2
Y1
Y2
E
C8051F52x/F52xA/F53x/F53xA
Rev. 1.3
3.90
3.90
0.20
2.75
0.65
2.75
Min
0.50 BSC.
Max
4.00
4.00
0.30
2.85
0.75
2.85
51
Related parts for C8051F537-IM
Image
Part Number
Description
Manufacturer
Datasheet
Request
R
Part Number:
Description:
SMD/C°/SINGLE-ENDED OUTPUT SILICON OSCILLATOR
Manufacturer:
Silicon Laboratories Inc
Part Number:
Description:
Manufacturer:
Silicon Laboratories Inc
Datasheet:
Part Number:
Description:
N/A N/A/SI4010 AES KEYFOB DEMO WITH LCD RX
Manufacturer:
Silicon Laboratories Inc
Datasheet:
Part Number:
Description:
N/A N/A/SI4010 SIMPLIFIED KEY FOB DEMO WITH LED RX
Manufacturer:
Silicon Laboratories Inc
Datasheet:
Part Number:
Description:
N/A/-40 TO 85 OC/EZLINK MODULE; F930/4432 HIGH BAND (REV E/B1)
Manufacturer:
Silicon Laboratories Inc
Part Number:
Description:
EZLink Module; F930/4432 Low Band (rev e/B1)
Manufacturer:
Silicon Laboratories Inc
Part Number:
Description:
I°/4460 10 DBM RADIO TEST CARD 434 MHZ
Manufacturer:
Silicon Laboratories Inc
Part Number:
Description:
I°/4461 14 DBM RADIO TEST CARD 868 MHZ
Manufacturer:
Silicon Laboratories Inc
Part Number:
Description:
I°/4463 20 DBM RFSWITCH RADIO TEST CARD 460 MHZ
Manufacturer:
Silicon Laboratories Inc
Part Number:
Description:
I°/4463 20 DBM RADIO TEST CARD 868 MHZ
Manufacturer:
Silicon Laboratories Inc
Part Number:
Description:
I°/4463 27 DBM RADIO TEST CARD 868 MHZ
Manufacturer:
Silicon Laboratories Inc
Part Number:
Description:
I°/4463 SKYWORKS 30 DBM RADIO TEST CARD 915 MHZ
Manufacturer:
Silicon Laboratories Inc
Part Number:
Description:
N/A N/A/-40 TO 85 OC/4463 RFMD 30 DBM RADIO TEST CARD 915 MHZ
Manufacturer:
Silicon Laboratories Inc
Part Number:
Description:
I°/4463 20 DBM RADIO TEST CARD 169 MHZ
Manufacturer:
Silicon Laboratories Inc