STR750FV2H6 STMicroelectronics, STR750FV2H6 Datasheet - Page 79
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STR750FV2H6
Manufacturer Part Number
STR750FV2H6
Description
MCU 32BIT 256KB FLASH 100-LFBGA
Manufacturer
STMicroelectronics
Series
STR7r
Datasheet
1.STR750FV0T6.pdf
(84 pages)
Specifications of STR750FV2H6
Core Processor
ARM7
Core Size
32-Bit
Speed
60MHz
Connectivity
CAN, I²C, SPI, SSI, SSP, UART/USART, USB
Peripherals
DMA, PWM, WDT
Number Of I /o
72
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
16K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 5.5 V
Data Converters
A/D 16x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
100-LFBGA
Data Bus Width
32 bit
Data Ram Size
16 KB
Interface Type
CAN, I2C, SPI, SSI, SSP, USB
Maximum Clock Frequency
60 MHz
Number Of Programmable I/os
72
Number Of Timers
6
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 16 Channel
For Use With
MCBSTR750UME - BOARD EVAL MCBSTR750 + ULINK-MEMCBSTR750U - BOARD EVAL MCBSTR750 + ULINK2497-5988 - BOARD DEVELOPMENT LOVE STR750497-5754 - KIT STARTER IAR STR750497-5753 - KIT STARTER KEIL FOR STR7/STR9497-5752 - KIT STARTER IAR FOR STR7/STR9497-5751 - KIT STARTER HITEX FOR STR750497-5748 - BOARD EVALUATION FOR STR750XF
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Details
Other names
497-5649
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
STR750FV2H6
Manufacturer:
STMicroelectronics
Quantity:
10 000
STR750Fxx STR751Fxx STR752Fxx STR755Fxx
7.2
7.2.1
Thermal characteristics
The maximum chip junction temperature (T
Table 10: General operating conditions on page
The maximum chip-junction temperature, T
using the following equation:
Where:
Table 48.
1. Thermal resistances are based on JEDEC JESD51-2 with 4-layer PCB in a natural convection
Reference document
JESD51-2 Integrated Circuits Thermal Test Method Environment Conditions - Natural
Convection (Still Air). Available from www.jedec.org
environment.
Symbol
–
–
–
–
–
Θ
Θ
Θ
Θ
JA
JA
JA
JA
T
Θ
P
P
chip internal power.
P
Where:
P
taking into account the actual V
level in the application.
Amax
Dmax
INTmax
I/Omax
I/Omax
JA
Thermal characteristics
is the Package Junction-to-Ambient Thermal Resistance, in ° C/W,
Thermal Resistance Junction-Ambient
LQFP 100 - 14 x 14 mm / 0.5 mm pitch
Thermal Resistance Junction-Ambient
LQFP 64 - 10 x 10 mm / 0.5 mm pitch
Thermal Resistance Junction-Ambient
LFBGA 64 - 8 x 8 x 1.7mm
Thermal Resistance Junction-Ambient
LFBGA 100 - 10 x 10 x 1.7mm
is the maximum Ambient Temperature in °C,
is the sum of P
= Σ (V
represents the maximum Power Dissipation on Output Pins.
is the product of I
OL
*I
OL
) + Σ((V
T
INTmax
Jmax
Parameter
DD
= T
DD
(1)
and P
and V
Amax
-V
OL
OH
Jmax
Jmax
/ I
I/Omax
DD
)*I
+ (P
OL
, expressed in Watts. This is the maximum
OH
) must never exceed the values given in
, in degrees Celsius, may be calculated
34.
and V
Dmax
),
(P
Dmax
OH
x Θ
/ I
JA
= P
OH
)
INTmax
of the I/Os at low and high
Package characteristics
+ P
Value
46
45
58
41
I/Omax
),
°C/W
°C/W
°C/W
°C/W
Unit
79/84