STR750FV2H6 STMicroelectronics, STR750FV2H6 Datasheet - Page 43
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STR750FV2H6
Manufacturer Part Number
STR750FV2H6
Description
MCU 32BIT 256KB FLASH 100-LFBGA
Manufacturer
STMicroelectronics
Series
STR7r
Datasheet
1.STR750FV0T6.pdf
(84 pages)
Specifications of STR750FV2H6
Core Processor
ARM7
Core Size
32-Bit
Speed
60MHz
Connectivity
CAN, I²C, SPI, SSI, SSP, UART/USART, USB
Peripherals
DMA, PWM, WDT
Number Of I /o
72
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
16K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 5.5 V
Data Converters
A/D 16x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
100-LFBGA
Data Bus Width
32 bit
Data Ram Size
16 KB
Interface Type
CAN, I2C, SPI, SSI, SSP, USB
Maximum Clock Frequency
60 MHz
Number Of Programmable I/os
72
Number Of Timers
6
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 16 Channel
For Use With
MCBSTR750UME - BOARD EVAL MCBSTR750 + ULINK-MEMCBSTR750U - BOARD EVAL MCBSTR750 + ULINK2497-5988 - BOARD DEVELOPMENT LOVE STR750497-5754 - KIT STARTER IAR STR750497-5753 - KIT STARTER KEIL FOR STR7/STR9497-5752 - KIT STARTER IAR FOR STR7/STR9497-5751 - KIT STARTER HITEX FOR STR750497-5748 - BOARD EVALUATION FOR STR750XF
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Details
Other names
497-5649
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
STR750FV2H6
Manufacturer:
STMicroelectronics
Quantity:
10 000
STR750Fxx STR751Fxx STR752Fxx STR755Fxx
On-Chip peripheral power consumption
Conditions:
Table 19.
1. Data based on a differential I
2. Data based on a differential I
3. Data based on a differential I
4. Data based on a differential I
5. Data based on a differential I
6. Data based on a differential I
7. Data based on a differential I
8. Data based on a differential IDD measurement between reset configuration (CAN disabled) and a
.
MHz. No IC/OC programmed (no I/O pads toggling)
This measurement does not include PWM pads toggling consumption.
communication at maximum speed 16 MHz. The data sent is 55h. This measurement does not include the
pad toggling consumption.
transmit sequence at 1Mbauds. This measurement does not include the pad toggling consumption.
I2C master communication at 100kHz (data sent equal to 55h). This measurement includes the pad
toggling consumption but not the external 10kOhm external pull-up on clock and data lines.
conversions at 8 MHz in scan mode on 16 inputs configured as AIN.
application.
permanent CAN data transmit sequence in loopback mode at 1MHz. This measurement does not include
the pad toggling consumption.
I
I
Symbol
I
I
I
I
DD(UART)
DD(PWM)
I
I
DD(ADC)
DD(USB)
DD(CAN)
DD(SSP)
DD(TIM)
DD(I2C)
–
–
–
V
T
Clocked by OSC4M with PLL multiplication, f
f
PCLK
A
DD_IO
= 25° C
On-Chip peripherals
=32 MHz
TIM Timer supply current
PWM Timer supply current
SSP supply current
UART supply current
I2C supply current
ADC supply current when converting
USB supply current
Note: V
CAN supply current
=V
DDA_ADC
DD_IO
DD
DD
DD
DD
DD
DD
DD
=V
must be 3.3 V ±10%
measurement between reset configuration (I2C disabled) and a permanent
measurement between reset configuration and timer counter running at 32
measurement between reset configuration and PWM running at 32 MHz.
measurement between reset configuration and permanent SPI master
measurement between reset configuration and a permanent UART data
measurement between reset configuration and continuous A/D
measurement between reset configuration and a running generic HID
DDA_PLL
(5)
(3)
(7)
(8)
(4)
Parameter
=3.3 V or 5 V ±10% unless otherwise specified.
(1)
(2)
(6)
CK_SYS
=64 MHz, f
(3.3V and 5.0V)
Electrical parameters
0.90
HCLK
Typ
0.7
1.3
1.6
0.3
1.2
2.8
1
=32 MHz,
Unit
mA
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