SAK-XE167FM-72F80L AA Infineon Technologies, SAK-XE167FM-72F80L AA Datasheet - Page 48
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SAK-XE167FM-72F80L AA
Manufacturer Part Number
SAK-XE167FM-72F80L AA
Description
IC MCU 16BIT FLASH 144-LQFP
Manufacturer
Infineon Technologies
Series
XE16xr
Datasheet
1.SAF-XE167KM-48F80L_AA.pdf
(140 pages)
Specifications of SAK-XE167FM-72F80L AA
Core Processor
C166SV2
Core Size
16-Bit
Speed
80MHz
Connectivity
CAN, EBI/EMI, I²C, LIN, SPI, SSC, UART/USART, USI
Peripherals
I²S, POR, PWM, WDT
Number Of I /o
119
Program Memory Size
576KB (576K x 8)
Program Memory Type
FLASH
Ram Size
50K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 5.5 V
Data Converters
A/D 24x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Package / Case
144-LFQFP
Data Bus Width
16 bit
Data Ram Size
32 KB
Interface Type
CAN, UART, SPI, I2S
Maximum Clock Frequency
80 MHz
Number Of Programmable I/os
119
Number Of Timers
5
Maximum Operating Temperature
+ 125 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 40 C
On-chip Adc
2 (10 bit, 24 Channel)
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Details
Other names
SP000628636
- Current page: 48 of 140
- Download datasheet (2Mb)
Table 4
Pin
2,
36,
38,
72,
74,
108,
110,
144
1,
37,
73,
109
1) To generate the reference clock output for bus timing measurement,
Data Sheet
EXTCLK and P2.8 must be selected as output pin. Also the high-speed clock pad must be enabled. This
configuration is referred to as reference clock output signal CLKOUT.
Symbol
V
V
DDPB
SS
Pin Definitions and Functions (cont’d)
Ctrl.
-
-
Type Function
PS/B Digital Pad Supply Voltage for Domain B
PS/-- Digital Ground
Connect decoupling capacitors to adjacent
V
Note: The on-chip voltage regulators and all ports
All
or ground-plane.
Note: Also the exposed pad is connected
XE167FM, XE167GM, XE167HM, XE167KM
SS
V
pin pairs as close as possible to the pins.
SS
48
XE166 Family Derivatives / Base Line
except P5, P6 and P15 are fed from supply
voltage
internally to
behavior, it is recommended to connect the
exposed pad to the board ground.
For thermal aspects, please refer to
Section
given in an application note.
pins must be connected to the ground-line
V
5.1. Board layout examples are
DDPB
.
V
General Device Information
SS
f
SYS
. To improve the EMC
must be selected as source for
V2.0, 2009-03
V
DDP
/
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