SAK-XE167FM-72F80L AA Infineon Technologies, SAK-XE167FM-72F80L AA Datasheet - Page 137
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SAK-XE167FM-72F80L AA
Manufacturer Part Number
SAK-XE167FM-72F80L AA
Description
IC MCU 16BIT FLASH 144-LQFP
Manufacturer
Infineon Technologies
Series
XE16xr
Datasheet
1.SAF-XE167KM-48F80L_AA.pdf
(140 pages)
Specifications of SAK-XE167FM-72F80L AA
Core Processor
C166SV2
Core Size
16-Bit
Speed
80MHz
Connectivity
CAN, EBI/EMI, I²C, LIN, SPI, SSC, UART/USART, USI
Peripherals
I²S, POR, PWM, WDT
Number Of I /o
119
Program Memory Size
576KB (576K x 8)
Program Memory Type
FLASH
Ram Size
50K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 5.5 V
Data Converters
A/D 24x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Package / Case
144-LFQFP
Data Bus Width
16 bit
Data Ram Size
32 KB
Interface Type
CAN, UART, SPI, I2S
Maximum Clock Frequency
80 MHz
Number Of Programmable I/os
119
Number Of Timers
5
Maximum Operating Temperature
+ 125 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 40 C
On-chip Adc
2 (10 bit, 24 Channel)
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Details
Other names
SP000628636
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5
In addition to the electrical parameters, the following specifications ensure proper
integration of the XE167xM into the target system.
5.1
These parameters specify the packaging rather than the silicon.
Table 40
Parameter
Exposed Pad Dimension
Power Dissipation
Thermal resistance
Junction-Ambient
1) Device mounted on a 2-layer JEDEC board (according to JESD 51-3) or a 4-layer board without thermal vias;
2) Device mounted on a 4-layer JEDEC board (according to JESD 51-7) with thermal vias; exposed pad not
3) Device mounted on a 4-layer JEDEC board (according to JESD 51-7) with thermal vias; exposed pad soldered
Note: To improve the EMC behavior, it is recommended to connect the exposed pad to
Package Compatibility Considerations
The XE167xM is a member of the XE166 Family of microcontrollers. It is also compatible
to a certain extent with members of similar series and subfamilies.
Each package is optimized for the chip it houses. Therefore, there may be slight
differences between packages of the same pin-count but for different device types. In
particular, the size of the Exposed Pad (if present) may vary.
If different device types are considered or planned for an application, it must be ensured
that the board layout fits all packages under consideration.
Data Sheet
exposed pad not soldered.
soldered.
to the board.
the board ground, independent of the thermal requirements.
Board layout examples are given in an application note.
Package and Reliability
Packaging
Package Parameters (PG-LQFP-144-13)
Symbol
Ex × Ey –
P
R
DISS
ΘJA
XE167FM, XE167GM, XE167HM, XE167KM
Min.
–
–
137
XE166 Family Derivatives / Base Line
Limit Values
Max.
6.5 × 6.5
1.0
43
34
21
Package and Reliability
Unit Notes
mm –
W
K/W No thermal via
K/W 4-layer, no pad
K/W 4-layer, pad
–
V2.0, 2009-03
3)
1)
2)
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