UPD70F3747GB-GAH-AX Renesas Electronics America, UPD70F3747GB-GAH-AX Datasheet - Page 76

• Manufacturer Part Number: UPD70F3747GB-GAH-AX
• Description: MCU 32BIT V850ES/HX3 64-LQFP
• Manufacturer: Renesas Electronics America
• Series: V850ES/Hx3r

Specifications of UPD70F3747GB-GAH-AX

• Core Processor: RISC
• Core Size: 32-Bit
• Speed: 32MHz
• Connectivity: CSI, I²C, UART/USART
• Peripherals: DMA, LVD, PWM, WDT
• Number Of I /o: 51
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 3.7 V ~ 5.5 V
• Data Converters: A/D 10x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: *
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

3.4
3.4.1
an internal RAM area, are supported in a linear address space (program space) of up to 64 MB. For operand
addressing (data access), up to 4 GB of a linear address space (data space) is supported. The 4 GB address space,
however, is viewed as 64 images of a 64 MB physical address space. This means that the same 64 MB physical
address space is accessed regardless of the value of bits 31 to 26.
74
For instruction addressing, up to a combined total of 16 MB of external memory area and internal ROM area, plus
Note The external memory area is available only in the V850ES/HJ3, and is a use-prohibited area in other
Remark
Address Space
CPU address space
products
The same image as image 0 appears on images 1 to 63 of the data space.
64 MB
External memory area
(external memory area)
Use-prohibited area
Use-prohibited area
Internal ROM area
Internal RAM area
Program space
Figure 3-1. Image on Address Space
CHAPTER 3 CPU FUNCTION
User’s Manual U18854EJ2V0UD
Note
16 MB
4 GB
External memory area
(external memory area)
Use-prohibited area
Peripheral I/O area
Internal RAM area
Internal ROM area
Data space
Image 63
(64 MB)
Image 1
(64 MB)
Note
Image 0
(64 MB)