SAK-XE162HN-16F80L AA Infineon Technologies, SAK-XE162HN-16F80L AA Datasheet - Page 30
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SAK-XE162HN-16F80L AA
Manufacturer Part Number
SAK-XE162HN-16F80L AA
Description
IC MCU 16BIT 128KB FLASH 64LQFP
Manufacturer
Infineon Technologies
Series
XE16xr
Datasheet
1.SAF-XE162HN-16F80L_AA.pdf
(107 pages)
Specifications of SAK-XE162HN-16F80L AA
Core Processor
C166SV2
Core Size
16-Bit
Speed
80MHz
Connectivity
EBI/EMI, I²C, LIN, SPI, SSC, UART/USART, USI
Peripherals
I²S, POR, PWM, WDT
Number Of I /o
40
Program Memory Size
128KB (128K x 8)
Program Memory Type
FLASH
Ram Size
18K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 5.5 V
Data Converters
A/D 9x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Package / Case
64-LFQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
XE162FN, XE162HN
XE166 Family / Value Line
Functional Description
Up to 16 Kbytes of on-chip Data SRAM (DSRAM) are used for storage of general user
data. The DSRAM is accessed via a separate interface and is optimized for data access.
Note: The actual size of the DSRAM depends on the quoted device type.
2 Kbytes of on-chip Dual-Port RAM (DPRAM) provide storage for user-defined
variables, for the system stack, and for general purpose register banks. A register bank
can consist of up to 16 word-wide (R0 to R15) and/or byte-wide (RL0, RH0, …, RL7,
RH7) General Purpose Registers (GPRs).
The upper 256 bytes of the DPRAM are directly bit addressable. When used by a GPR,
any location in the DPRAM is bit addressable.
8 Kbytes of on-chip Stand-By SRAM (SBRAM) provide storage for system-relevant
user data that must be preserved while the major part of the device is powered down.
The SBRAM is accessed via a specific interface and is powered in domain M.
1024 bytes (2 × 512 bytes) of the address space are reserved for the Special Function
Register areas (SFR space and ESFR space). SFRs are word-wide registers which are
used to control and monitor functions of the different on-chip units. Unused SFR
addresses are reserved for future members of the XE166 Family. In order to ensure
upward compatibility they should either not be accessed or written with zeros.
In order to meet the requirements of designs where more memory is required than is
available on chip, up to 12 Mbytes (approximately, see
Table
7) of external RAM and/or
ROM can be connected to the microcontroller. The External Bus Interface also provides
access to external peripherals.
The on-chip Flash memory stores code, constant data, and control data. The
320 Kbytes of on-chip Flash memory consist of 1 module of 64 Kbytes (preferably for
data storage) and 1 module of 256 Kbytes. Each module is organized in 4-Kbyte sectors.
The uppermost 4-Kbyte sector of segment 0 (located in Flash module 0) is used
internally to store operation control parameters and protection information.
Note: The actual size of the Flash memory depends on the chosen device type.
1)
Each sector can be separately write protected
, erased and programmed (in blocks of
128 Bytes). The complete Flash area can be read-protected. A user-defined password
sequence temporarily unlocks protected areas. The Flash modules combine 128-bit
read access with protected and efficient writing algorithms for programming and erasing.
Dynamic error correction provides extremely high read data security for all read access
operations. Access to different Flash modules can be executed in parallel.
For Flash parameters, please see
Section
4.6.
1) To save control bits, sectors are clustered for protection purposes, they remain separate for
programming/erasing.
Data Sheet
30
V1.3, 2010-04