SAK-XE162HN-16F80L AA Infineon Technologies, SAK-XE162HN-16F80L AA Datasheet - Page 104

• Manufacturer Part Number: SAK-XE162HN-16F80L AA
• Description: IC MCU 16BIT 128KB FLASH 64LQFP
• Manufacturer: Infineon Technologies
• Series: XE16xr

Specifications of SAK-XE162HN-16F80L AA

• Core Processor: C166SV2
• Core Size: 16-Bit
• Speed: 80MHz
• Connectivity: EBI/EMI, I²C, LIN, SPI, SSC, UART/USART, USI
• Peripherals: I²S, POR, PWM, WDT
• Number Of I /o: 40
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• Ram Size: 18K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 5.5 V
• Data Converters: A/D 9x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 64-LFQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

5
The XE166 Family devices use the package type PG-LQFP (Plastic Green - Low Profile
Quad Flat Package). The following specifications must be regarded to ensure proper
integration of the XE162xN in its target environment.
5.1
These parameters specify the packaging rather than the silicon.
Table 37
Parameter
Exposed Pad Dimension
Power Dissipation
Thermal resistance
Junction-Ambient
1) Device mounted on a 4-layer board without thermal vias; exposed pad not soldered.
2) Device mounted on a 4-layer JEDEC board (according to JESD 51-7) with thermal vias; exposed pad not
3) Device mounted on a 4-layer JEDEC board (according to JESD 51-7) with thermal vias; exposed pad soldered
Note: To improve the EMC behavior, it is recommended to connect the exposed pad to
Package Compatibility Considerations
The XE162xN is a member of the XE166 Family of microcontrollers. It is also
compatible to a certain extent with members of similar families or subfamilies.
Each package is optimized for the device it houses. Therefore, there may be slight
differences between packages of the same pin-count but for different device types. In
particular, the size of the Exposed Pad (if present) may vary.
If different device types are considered or planned for an application, it must be ensured
that the board layout fits all packages under consideration.
Data Sheet
soldered.
to the board.
the board ground, independent of the thermal requirements.
Board layout examples are given in an application note.
Package and Reliability
Packaging
Package Parameters (PG-LQFP-64-6)
Symbol
Ex × Ey –
P
R
DISS
ΘJA
Min.
–
–
104
Limit Values
Max.
5.6 × 5.6
0.8
40
37
25
XE166 Family / Value Line
Package and Reliability
XE162FN, XE162HN
Unit Notes
mm –
W
K/W No thermal via
K/W 4-layer, no pad
K/W 4-layer, pad
–
V1.3, 2010-04
3)
1)
2)