SAK-XE162HN-16F80L AA Infineon Technologies, SAK-XE162HN-16F80L AA Datasheet - Page 100

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SAK-XE162HN-16F80L AA

Manufacturer Part Number
SAK-XE162HN-16F80L AA
Description
IC MCU 16BIT 128KB FLASH 64LQFP
Manufacturer
Infineon Technologies
Series
XE16xr
Datasheet

Specifications of SAK-XE162HN-16F80L AA

Core Processor
C166SV2
Core Size
16-Bit
Speed
80MHz
Connectivity
EBI/EMI, I²C, LIN, SPI, SSC, UART/USART, USI
Peripherals
I²S, POR, PWM, WDT
Number Of I /o
40
Program Memory Size
128KB (128K x 8)
Program Memory Type
FLASH
Ram Size
18K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 5.5 V
Data Converters
A/D 9x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Package / Case
64-LFQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Figure 24
Figure 25
Note: The transmission timing is determined by the receiving debugger by evaluating the
Debug via JTAG
The following parameters are applicable for communication through the JTAG debug
interface. The JTAG module is fully compliant with IEEE1149.1-2000.
Note: These parameters are not subject to production test but verified by design and/or
Note: Operating Conditions apply.
Table 35
Table 35
Parameter
TCK clock period
TCK high time
Data Sheet
DAP0
DAP1
DAP1
sync-request synchronization pattern telegram.
characterization.
is valid under the following conditions:
DAP Timing Host to Device
DAP Timing Device to Host
JTAG Interface Timing for Upper Voltage Range
Symbol
t
t
1
2
SR
SR
Min.
50
16
100
Values
Typ.
C
t
L
1 6
= 20 pF; voltage_range= upper
Max.
XE166 Family / Value Line
t
t
1 9
1 1
t
1 7
Unit Note /
ns
ns
XE162FN, XE162HN
Electrical Parameters
Test Condition
MC_ DAP1_RX
MC_ DAP1_TX
1)
V1.3, 2010-04

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