DF2166VT33 Renesas Electronics America, DF2166VT33 Datasheet - Page 539

MCU FLASH 3V 512K 33MHZ 144TQFP

DF2166VT33

Manufacturer Part Number
DF2166VT33
Description
MCU FLASH 3V 512K 33MHZ 144TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2100r
Datasheet

Specifications of DF2166VT33

Core Processor
H8S/2000
Core Size
16-Bit
Speed
33MHz
Connectivity
I²C, IrDA, LPC, SCI, SmartCard
Peripherals
POR, PWM, WDT
Number Of I /o
106
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
Ram Size
40K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
External
Operating Temperature
-20°C ~ 75°C
Package / Case
144-TQFP, 144-VQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-

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t
to provide coding to secure the necessary interval (approximately 1 µs) between issuance of a
stop condition and issuance of a start condition, or (b) to select devices whose input timing
permits this output timing for use as slave devices connected to the I
t
specifications for worst-case calculations of t
include (a) adjusting the rise and fall times by means of a pull-up resistor and capacitive load,
(b) reducing the transfer rate to meet the specifications, or (c) selecting devices whose input
timing permits this output timing for use as slave devices connected to the I
BUFO
SCLLO
fails to meet the I
in high-speed mode and t
2
C bus interface specifications at any frequency. The solution is either (a)
STASO
in standard mode fail to satisfy the I
Sr
/t
Sf
. Possible solutions that should be investigated
Rev. 3.00, 03/04, page 497 of 830
2
C bus.
2
C bus interface
2
C bus.

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