HD64F2239FA16 Renesas Electronics America, HD64F2239FA16 Datasheet - Page 826
HD64F2239FA16
Manufacturer Part Number
HD64F2239FA16
Description
IC H8S MCU FLASH 384K 100-QFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2200r
Specifications of HD64F2239FA16
Core Processor
H8S/2000
Core Size
16-Bit
Speed
16MHz
Connectivity
I²C, SCI, SmartCard
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
72
Program Memory Size
384KB (384K x 8)
Program Memory Type
FLASH
Ram Size
32K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-QFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Available stocks
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Company:
Part Number:
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Manufacturer:
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Part Number:
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Manufacturer:
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Section 22 PROM
• The size of the PROM is 128 kbytes. Always set addresses within the range H'00000 to
22.3.3
An effective way to assure the data retention characteristics of the programmed chips is to bake
them at 150°C, then screen them for data errors. This procedure quickly eliminates chips with
PROM memory cells prone to early failure.
Figure 22.6 shows the recommended screening procedure.
If a series of programming errors occurs while the same PROM programmer is being used, stop
programming and check the PROM programmer and socket adapter for defects.
Please inform Renesas Technology of any abnormal conditions noted during or after programming
or in screening of program data after high-temperature baking.
Rev. 6.00 Mar. 18, 2010 Page 764 of 982
REJ09B0054-0600
H'1FFFF. During programming, write H'FF to unused addresses to avoid verification errors.
Reliability of Programmed Data
Figure 22.6 Recommended Screening Procedure
Programing the chip and
Read and check program
hours at 125°C to 150°C
Bake chip for 24 to 48
verify programed data
with power off
Mount
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