HD64F2239FA16 Renesas Electronics America, HD64F2239FA16 Datasheet - Page 811

• Manufacturer Part Number: HD64F2239FA16
• Description: IC H8S MCU FLASH 384K 100-QFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8S/2200r

Specifications of HD64F2239FA16

• Core Processor: H8S/2000
• Core Size: 16-Bit
• Speed: 16MHz
• Connectivity: I²C, SCI, SmartCard
• Peripherals: DMA, POR, PWM, WDT
• Number Of I /o: 72
• Program Memory Size: 384KB (384K x 8)
• Program Memory Type: FLASH
• Ram Size: 32K x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-QFP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -

V
FWE
MD2 to MD0 *
RES
SWE1 bit
φ
Notes:
CC
Period during which flash memory access is prohibited
(t
Period during which flash memory can be programmed
(Execution of program in flash memory prohibited, and data reads other than verify operations
prohibited)
1.
2.
3.
sswe
Figure 20.15 Power-On/Off Timing (User Program Mode)
Except when switching modes, the level of the mode pins (MD2 to MD0) must be fixed until
power-off by pulling the pins up or down.
See sections 27.2.6, 27.3.6, 27.4.6, 27.5.6 and 27.6.6, Flash Memory Characteristics.
Mode programming setup time t
: Wait time after setting SWE1 bit) *
1
t
OSC1
t
MDS
SWE1 set
Wait time:
*
3
MDS
2
(min) = 200 ns.
t
sswe
Programming/
erasing
possible
Section 20 Flash Memory (F-ZTAT Version)
Rev. 6.00 Mar. 18, 2010 Page 749 of 982
Wait time:
SWE1 cleared
100 μs
min 0 μs
REJ09B0054-0600