HD64F3687GFP Renesas Electronics America, HD64F3687GFP Datasheet - Page 73
![IC H8 MCU FLASH 56K 64-LQFP](/photos/28/61/286107/64-lqfp__plqp0064kc-a_sml.jpg)
HD64F3687GFP
Manufacturer Part Number
HD64F3687GFP
Description
IC H8 MCU FLASH 56K 64-LQFP
Manufacturer
Renesas Electronics America
Series
H8® H8/300H Tinyr
Datasheet
1.HD64F3684GFPV.pdf
(538 pages)
Specifications of HD64F3687GFP
Core Processor
H8/300H
Core Size
16-Bit
Speed
20MHz
Connectivity
I²C, SCI
Peripherals
LVD, POR, PWM, WDT
Number Of I /o
45
Program Memory Size
56KB (56K x 8)
Program Memory Type
FLASH
Ram Size
4K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 5.5 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
64-LQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
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HD64F3687GFP
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Renesas Electronics America
Quantity:
10 000
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HD64F3687GFPMV
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2.6.2
On-chip peripheral modules are accessed in two states or three states. The data bus width is 8 bits
or 16 bits depending on the register. For description on the data bus width and number of
accessing states of each register, refer to section 22.1, Register Addresses (Address Order).
Registers with 16-bit data bus width can be accessed by word size only. Registers with 8-bit data
bus width can be accessed by byte or word size. When a register with 8-bit data bus width is
accessed by word size, a bus cycle occurs twice. In two-state access, the operation timing is the
same as that for on-chip memory.
Figure 2.10 shows the operation timing in the case of three-state access to an on-chip peripheral
module.
On-Chip Peripheral Modules
Figure 2.10 On-Chip Peripheral Module Access Cycle (3-State Access)
Internal
address bus
Internal
read signal
Internal
data bus
(read access)
Internal
write signal
Internal
data bus
(write access)
or
SUB
T
1
state
Address
Bus cycle
T
2
state
Read data
Write data
Rev.5.00 Nov. 02, 2005 Page 39 of 500
T
3
state
REJ09B0027-0500
Section 2 CPU
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