HD64F3687GFP Renesas Electronics America, HD64F3687GFP Datasheet - Page 73

• Manufacturer Part Number: HD64F3687GFP
• Description: IC H8 MCU FLASH 56K 64-LQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300H Tinyr

Specifications of HD64F3687GFP

• Core Processor: H8/300H
• Core Size: 16-Bit
• Speed: 20MHz
• Connectivity: I²C, SCI
• Peripherals: LVD, POR, PWM, WDT
• Number Of I /o: 45
• Program Memory Size: 56KB (56K x 8)
• Program Memory Type: FLASH
• Ram Size: 4K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 5.5 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 64-LQFP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -

2.6.2
On-chip peripheral modules are accessed in two states or three states. The data bus width is 8 bits
or 16 bits depending on the register. For description on the data bus width and number of
accessing states of each register, refer to section 22.1, Register Addresses (Address Order).
Registers with 16-bit data bus width can be accessed by word size only. Registers with 8-bit data
bus width can be accessed by byte or word size. When a register with 8-bit data bus width is
accessed by word size, a bus cycle occurs twice. In two-state access, the operation timing is the
same as that for on-chip memory.
Figure 2.10 shows the operation timing in the case of three-state access to an on-chip peripheral
module.
On-Chip Peripheral Modules
Figure 2.10 On-Chip Peripheral Module Access Cycle (3-State Access)
Internal
address bus
Internal
read signal
Internal
data bus
(read access)
Internal
write signal
Internal
data bus
(write access)
or
SUB
T
1
state
Address
Bus cycle
T
2
state
Read data
Write data
Rev.5.00 Nov. 02, 2005 Page 39 of 500
T
3
state
REJ09B0027-0500
Section 2 CPU