HD64F3687GFP Renesas Electronics America, HD64F3687GFP Datasheet - Page 7
![IC H8 MCU FLASH 56K 64-LQFP](/photos/28/61/286107/64-lqfp__plqp0064kc-a_sml.jpg)
HD64F3687GFP
Manufacturer Part Number
HD64F3687GFP
Description
IC H8 MCU FLASH 56K 64-LQFP
Manufacturer
Renesas Electronics America
Series
H8® H8/300H Tinyr
Datasheet
1.HD64F3684GFPV.pdf
(538 pages)
Specifications of HD64F3687GFP
Core Processor
H8/300H
Core Size
16-Bit
Speed
20MHz
Connectivity
I²C, SCI
Peripherals
LVD, POR, PWM, WDT
Number Of I /o
45
Program Memory Size
56KB (56K x 8)
Program Memory Type
FLASH
Ram Size
4K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 5.5 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
64-LQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Available stocks
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Part Number:
HD64F3687GFP
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Renesas Electronics America
Quantity:
10 000
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HD64F3687GFPMV
Manufacturer:
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Part Number:
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Renesas Electronics America
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This manual comprises the following items:
1. General Precautions on Handling of Product
2. Configuration of This Manual
3. Preface
4. Contents
5. Overview
6. Description of Functional Modules
When designing an application system that includes this LSI, take notes into account. Each section
includes notes in relation to the descriptions given, and usage notes are given, as required, as the
final part of each section.
7. List of Registers
8. Electrical Characteristics
9. Appendix
10. Main Revisions and Additions in this Edition (only for revised versions)
The list of revisions is a summary of points that have been revised or added to earlier versions.
This does not include all of the revised contents. For details, see the actual locations in this
manual.
11. Index
•
•
i) Feature
ii) Input/Output Pin
iii) Register Description
iv) Operation
v) Usage Note
The configuration of the functional description of each module differs according to the
module. However, the generic style includes the following items:
CPU and System-Control Modules
On-Chip Peripheral Modules
Configuration of This Manual
Rev.5.00 Nov. 02, 2005 Page v of xxxii
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