MCF5329CVM240J Freescale Semiconductor, MCF5329CVM240J Datasheet - Page 14

• Manufacturer Part Number: MCF5329CVM240J
• Description: IC MPU RISC 240MHZ 256MAPBGA
• Manufacturer: Freescale Semiconductor
• Series: MCF532xr

Specifications of MCF5329CVM240J

• Core Processor: Coldfire V3
• Core Size: 32-Bit
• Speed: 240MHz
• Connectivity: CAN, EBI/EMI, Ethernet, I²C, SPI, SSI, UART/USART, USB, USB OTG
• Peripherals: DMA, LCD, PWM, WDT
• Number Of I /o: 94
• Program Memory Type: ROMless
• Ram Size: 32K x 8
• Voltage - Supply (vcc/vdd): 1.4 V ~ 3.6 V
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 256-MAPBGA
• Family Name: MPC5xxx
• Device Core: ColdFire
• Device Core Size: 32b
• Frequency (max): 240MHz
• Instruction Set Architecture: RISC
• Supply Voltage 1 (typ): 1.8/2.5/3.3V
• Operating Supply Voltage (max): 1.6/1.95/2.75/3.6V
• Operating Supply Voltage (min): 1.4/1.7/2.25/3V
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 256
• Package Type: MA-BGA
• Processor Series: MCF532xx
• Core: ColdFire V3
• 3rd Party Development Tools: JLINK-CF-BDM26, EWCF
• Leaded Process Compatible: Yes
• Rohs Compliant: Yes
• Peak Reflow Compatible (260 C): Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Program Memory Size: -
• Data Converters: -
• Lead Free Status / Rohs Status: Compliant

M
A
B
C
D
E
F
G
H
K
N
P
R SD_CLK SD_CLK SD_RAS
T
J
L
SD_DR
DT2IN
DT3IN
DQS3
_DQS
FEC_
TXER
FEC_
FEC_
TXD1
MDC
SSI_
TXD
SD_
CS0
D13
SD_
D31
D27
NC
NC
D9
1
1
Pin Assignments and Reset States
4.2
Figure 4
14
Figure 4. MCF5328CVM240, MCF53281CVM240, and MCF5329CVM240 Pinout Top View (256 MAPBGA)
SD_CKE
SD_A10
FB_CLK
TXCLK
DT1IN
TXEN
MDIO
FEC_
FEC_
FEC_
FEC_
TXD2
I2C_
SSI_
RXD
SDA
D14
D10
D30
D26
D8
2
2
shows a pinout of the MCF5328CVM240, MCF53281CVM240, and MCF5329CVM240 devices.
Pinout—256 MAPBGA
SD_CAS
SD_WE
SSI_FS
DT0IN
BWE1
LCD_
LCD_
LCD_
FEC_
TXD3
I2C_
SCL
D15
D11
D29
D25
D23
BE/
D4
D1
D0
3
3
The pin at location N13 (PLL_TEST) must be left floating or improper operation of the
PLL module occurs.
SD_CS1 SD_VDD SD_VDD
RXER
MCLK
BWE3
LCD_
LCD_
LCD_
FEC_
FEC_
TXD0
BCLK
SSI_
SSI_
D12
D28
D24
D22
D21
D20
BE/
D5
D3
D2
TS
4
4
SD_VDD SD_VDD
SD_VDD SD_VDD SD_VDD SD_VDD
EVDD
EVDD
EVDD
LCD_
LCD_
LCD_
LCD_
IVDD
IVDD
D19
D18
D17
D16
D9
D8
D7
D6
5
5
MCF532x ColdFire
SD_VDD SD_VDD
EVDD
EVDD
EVDD
BWE0
BWE2
FEC_
RXD2
FEC_
RXD1
FEC_
RXD0
LCD_
LCD_
DQS2
D11
D10
SD_
BE/
BE/
D7
6
6
RXD3
EVDD
LCD_
LCD_
LCD_
LCD_
FEC_
VSS
VSS
VSS
VSS
D15
D14
D13
D12
D6
D5
D4
D3
7
7
®
RXCLK
RCON
EVDD
EVDD
FEC_
FEC_
FEC_
FEC_
RXDV
Microprocessor Data Sheet, Rev. 5
COL
CRS
VSS
VSS
VSS
VSS
R/W
D2
D1
D0
8
8
NOTE
NOTE
SD_VDD
SD_VDD SD_VDD
ACD/OE
PSTCLK
DDATA3
DDATA2
EVDD
EVDD
TCLK/
LCD_
LCD_
LCD_
LCD_
VSS
VSS
VSS
VSS
CLS
D17
D16
OE
9
9
LCD_FLM/
LCD_CON
LCD_LP/
DDATA1
DDATA0
HSYNC
VSYNC
TRAST
LSCLK
U1RTS
EVDD
EVDD
LCD_
PST3
PST2
VSS
VSS
VSS
VSS
10
10
SPL_SPR
SD_VDD
SD_VDD
SD_VDD
U1CTS
U1TXD
QSPI_
EVDD
EVDD
EVDD
LCD_
LCD_
LCD_
PST1
PST0
IVDD
TDO/
DSO
REV
CS0
PS
11
11
FB_CS3 FB_CS4
FB_CS2 FB_CS5
FB_CS1
FB_CS0
U1RXD
DRAM
QSPI_
QSPI_
QSPI_
QSPI_
EVDD
DOUT
IVDD
IVDD
PLL_
VDD
VSS
SEL
CLK
CS2
DIN
NC
12
12
PWM7
EXTAL
JTAG_
QSPI_
USB_
TEST
IRQ7
PLL_
PLL_
XTAL
VSS
VSS
CS1
A23
A22
A21
32K
32K
EN
A6
TA
13
13
Freescale Semiconductor
USBHOST
USBOTG
RSTOUT
TDI/DSI
U0RXD
U0TXD
PWM5
_VDD
_VSS
IRQ6
IRQ3
A20
A19
A18
A15
14
A9
A5
A0
14
HOST_M
OTG_M
RESET
DSCLK
U0CTS
U0RTS
PWM3
TRST/
IRQ5
IRQ2
USB
USB
A17
A16
A13
A11
15
A8
A4
A1
15
HOST_P
OTG_P
PWM1
EXTAL
TEST
BKPT
IRQ4
IRQ1
XTAL
TMS/
USB
USB
A14
A12
A10
NC
A7
A3
A2
16
16
M
A
B
C
D
E
F
G
H
K
N
P
R
T
J
L