MCF5270CAB100 Freescale Semiconductor, MCF5270CAB100 Datasheet - Page 19

no-image

MCF5270CAB100

Manufacturer Part Number
MCF5270CAB100
Description
MCU V2 COLDFIRE 64K SRAM 160-QFP
Manufacturer
Freescale Semiconductor
Series
MCF527xr
Datasheets

Specifications of MCF5270CAB100

Core Processor
Coldfire V2
Core Size
32-Bit
Speed
100MHz
Connectivity
EBI/EMI, Ethernet, I²C, SPI, UART/USART
Peripherals
DMA, WDT
Number Of I /o
39
Program Memory Type
ROMless
Ram Size
64K x 8
Voltage - Supply (vcc/vdd)
1.4 V ~ 1.6 V
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Package / Case
160-QFP
Processor Series
MCF527x
Core
ColdFire V2
3rd Party Development Tools
JLINK-CF-BDM26, EWCF
Development Tools By Supplier
NNDK-MOD5272-KIT, NNDK-MOD5270-KIT
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Program Memory Size
-
Data Converters
-
Lead Free Status / Rohs Status
 Details

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MCF5270CAB100
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
7.3
Freescale Semiconductor
Core Supply Voltage
Pad Supply Voltage
PLL Supply Voltage
Input High Voltage
Input Low Voltage
Input Hysteresis
Input Leakage Current
High Impedance (Off-State) Leakage Current
Output High Voltage (All input/output and all output pins)
I
Output Low Voltage (All input/output and all output pins)
I
Weak Internal Pull Up Device Current, tested at V
Input Capacitance
OH
OL
V
V
All input-only pins
All input/output (three-state) pins
in
in
= 5.0mA
= –5.0 mA
For most applications P
and T
Solving equations 1 and 2 for K gives:
where K is a constant pertaining to the particular part. K can be determined from equation (3)
by measuring P
T
= V
= V
J
can be obtained by solving equations (1) and (2) iteratively for any value of T
DD
DD
DC Electrical Specifications
J
T
Θ
P
P
P
or V
or V
A
D
INT
I/O
(if P
JMA
= Ambient Temperature, °C
= P
SS
SS
= Power Dissipation on Input and Output Pins — User Determined
= I
, Input-only pins
, All input/output and output pins
3
I/O
= Package Thermal Resistance, Junction-to-Ambient, °C/W
INT
DD
Characteristic
is neglected) is:
D
+ P
× V
MCF5271 Integrated Microprocessor Hardware Specification, Rev. 4
(at equilibrium) for a known T
I/O
DD
K = P
I/O
, Watts - Chip Internal Power
D
< P
× (T
Table 9. DC Electrical Specifications
INT
A
P
+ 273 °C) + Θ
and can be ignored. An approximate relationship between P
D
=
IL
K
Max.
÷
(
T
2
J
JMA
+
273°C
× P
A
Symbol
V
OV
V
. Using this value of K, the values of P
DDPLL
I
V
V
V
V
I
D
V
APU
C
HYS
I
OZ
)
DD
OH
in
OL
IH
IL
in
2
DD
(2)
(3)
0.06
0.7
OV
V
SS
–1.0
–1.0
DD
Min
×
–10
1.4
3.0
3.0
×
– 0.3
OV
OV
- 0.5
1
DD
DD
Typical
Electrical Characteristics
A
0.35
.
– 130
Max
3.65
1.6
3.6
3.6
1.0
1.0
0.5
×
7
7
OV
D
DD
and
D
Unit
mV
μA
μA
μA
pF
V
V
V
V
V
V
V
19

Related parts for MCF5270CAB100