MCF5270CAB100 Freescale Semiconductor, MCF5270CAB100 Datasheet - Page 10

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MCF5270CAB100

Manufacturer Part Number
MCF5270CAB100
Description
MCU V2 COLDFIRE 64K SRAM 160-QFP
Manufacturer
Freescale Semiconductor
Series
MCF527xr
Datasheets

Specifications of MCF5270CAB100

Core Processor
Coldfire V2
Core Size
32-Bit
Speed
100MHz
Connectivity
EBI/EMI, Ethernet, I²C, SPI, UART/USART
Peripherals
DMA, WDT
Number Of I /o
39
Program Memory Type
ROMless
Ram Size
64K x 8
Voltage - Supply (vcc/vdd)
1.4 V ~ 1.6 V
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Package / Case
160-QFP
Processor Series
MCF527x
Core
ColdFire V2
3rd Party Development Tools
JLINK-CF-BDM26, EWCF
Development Tools By Supplier
NNDK-MOD5272-KIT, NNDK-MOD5270-KIT
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Program Memory Size
-
Data Converters
-
Lead Free Status / Rohs Status
 Details

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MCF5270CAB100
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
Design Recommendations
will be undesired high current in the ESD protection diodes. There are no requirements for the fall times
of the power supplies.
The recommended power down sequence is as follows:
5.3
5.4
5.5
5.6
5.7
5.7.1
5.7.1.1
Table 3
10
1. Drop V
2. Drop OV
Place the decoupling caps as close to the pins as possible, but they can be outside the footprint of
the package.
0.1 μF and 0.01 μF at each supply input
Use bus buffers on all data/address lines for all off-board accesses and for all on-board accesses
when excessive loading is expected. See
Use external pull-up resistors on unused inputs. See pin table.
Use a multi-layer board with a separate ground plane.
Place the crystal and all other associated components as close to the EXTAL and XTAL (oscillator
pins) as possible.
Do not run a high frequency trace around crystal circuit.
Ensure that the ground for the bypass capacitors is connected to a solid ground trace.
Tie the ground trace to the ground pin nearest EXTAL and XTAL. This prevents large loop currents
in the vicinity of the crystal.
Tie the ground pin to the most solid ground in the system.
Do not connect the trace that connects the oscillator and the ground plane to any other circuit
element. This tends to make the oscillator unstable.
Tie XTAL to ground when an external oscillator is clocking the device.
shows the behavior of SDRAM signals in synchronous mode.
Decoupling
Buffering
Pull-up Recommendations
Clocking Recommendations
Interface Recommendations
SDRAM Controller
SDRAM Controller Signals in Synchronous Mode
DD
DD
to 0 V.
/V
DDPLL
MCF5271 Integrated Microprocessor Hardware Specification, Rev. 4
supplies.
Section 7, “Electrical
Characteristics.”
Freescale Semiconductor

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