MCF5270CAB100 Freescale Semiconductor, MCF5270CAB100 Datasheet - Page 16

• Manufacturer Part Number: MCF5270CAB100
• Description: MCU V2 COLDFIRE 64K SRAM 160-QFP
• Manufacturer: Freescale Semiconductor
• Series: MCF527xr

Specifications of MCF5270CAB100

• Core Processor: Coldfire V2
• Core Size: 32-Bit
• Speed: 100MHz
• Connectivity: EBI/EMI, Ethernet, I²C, SPI, UART/USART
• Peripherals: DMA, WDT
• Number Of I /o: 39
• Program Memory Type: ROMless
• Ram Size: 64K x 8
• Voltage - Supply (vcc/vdd): 1.4 V ~ 1.6 V
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 160-QFP
• Processor Series: MCF527x
• Core: ColdFire V2
• 3rd Party Development Tools: JLINK-CF-BDM26, EWCF
• Development Tools By Supplier: NNDK-MOD5272-KIT, NNDK-MOD5270-KIT
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Program Memory Size: -
• Data Converters: -
• Lead Free Status / Rohs Status: Details

Mechanicals/Pinouts and Part Numbers
6.4
Figure 6
16
Z
–C–
L
shows MCF5270/71CAB80 package dimensions.
–A–
C
Package Dimensions—160 QFP
E
Y
0.110 (0.004)
H
–H–
DETAIL C
MCF5271 Integrated Microprocessor Hardware Specification, Rev. 4
0.20 (0.008)
0.20 (0.008)
0.20 (0.008)
S
W
M
L
A
M
Figure 6. 160 QFP Package Dimensions
A-B
BOTTOM
DETAIL A
C
C
TOP &
X
M
A-B
K
A-B
×
U
×
S
S
Case 864A-03
D
D
R
Q
T
S
S
×
7. DIMENSION D DOES NOT INCLUDE DAMBAR
5. DIMENSIONS S AND V TO BE DETERMINED AT
6. DIMENSIONS A AND B DO NOT INCLUDE MOLD
NOTES
1. DIMENSIONING AND TOLERINCING PER ANSI
2. CONTROLLING DIMENSION: MILLIMETER
3. DATUM PLAN -H- IS LOCATED AT BOTTOM OF
4. DATUMS -A-, -B-, AND -D- TO BE DETERMINED AT
Y14.5M, 1982.
LEAD AND IS COINCIDENT WITH THE LEAD WHERE
THE LEAD EXITS THE PLASTIC BODY AT THE
BOTTOM OF THE PARTING LINE.
DATUM PLANE -H-.
SEATING PLANE -C-.
PROTRUSION. ALLOWABLE PROTRUSION IS 0.25
(0.010) PER SIDE. DIMENSIONS A AND B DO
INCLUDE MOLD MISMATCH AND ARE DETERMINED
AT DATUM PLANE -H-.
PROTRUSION. ALLOWABLE DAMBAR PROTRUSION
SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE D
DIMENSION AT MAXIMUM MATERIAL CONDITION.
DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OR THE FOOT.
–B–
DETAIL C
–H–
B
V
N
0.13 (0.005) M
B
SECTION B–B
B
DETAIL A
BASE
METAL
D
F
G
C
DIM
A
B
C
D
E
F
G
H
J
K
L
M
N
P
Q
R
S
T
U
V
W
X
Y
Z
A-B
MILLIMETERS
–A–, –B–, –D–
27.90
27.90
MIN
31.00
31.00
3.35
3.35
0.22
3.20
0.22
0.65 BSC
0.25
0.11
0.70
25.35 BSC
0.11
1.60 REF
1.33 REF
1.33 REF
0.325 BSC
0.13
0.13
0.4
Freescale Semiconductor
P
5
0
0
°
°
S
°
J
D
MAX
28.10 1.098 1.106
28.10 1.098 1.106
31.40 1.220 1.236
31.40 1.220 1.236
16
3.50
0.33
0.35
0.23
0.90
0.19
7
3.85 0.132 1.106
3.85
0.38
—
0.30
—
—
°
S
°
0.009 0.013
0.028 0.035
0.009 0.015
0.126 0.138
0.010 0.014
0.004 0.009
0.004 0.007
0.005 0.012
0.005
0.016
MIN
0.026 REF
0.998 REF
0.013 REF
0.063 REF
0.052 REF
0.052 REF
INCHES
0
5
0
°
°
°
MAX
16
—
—
—
7
°
°