MC9S12XET256MAL Freescale Semiconductor, MC9S12XET256MAL Datasheet - Page 474

• Manufacturer Part Number: MC9S12XET256MAL
• Description: MCU 16BIT 256K FLASH 112-LQFP
• Manufacturer: Freescale Semiconductor
• Series: HCS12r

Specifications of MC9S12XET256MAL

• Core Processor: HCS12X
• Core Size: 16-Bit
• Speed: 50MHz
• Connectivity: CAN, EBI/EMI, I²C, IrDA, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number Of I /o: 91
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Eeprom Size: 4K x 8
• Ram Size: 16K x 8
• Voltage - Supply (vcc/vdd): 1.72 V ~ 5.5 V
• Data Converters: A/D 12x12b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 112-LQFP
• Cpu Family: HCS12X
• Device Core Size: 16b
• Frequency (max): 50MHz
• Interface Type: CAN/SCI/SPI
• Total Internal Ram Size: 16KB
• # I/os (max): 91
• Number Of Timers - General Purpose: 25
• Operating Supply Voltage (typ): 1.8/2.8/5V
• Operating Supply Voltage (max): 1.98/2.9/5.5V
• Operating Supply Voltage (min): 1.72/2.7/3.13V
• On-chip Adc: 16-chx12-bit
• Instruction Set Architecture: RISC
• Operating Temp Range: -40C to 125C
• Operating Temperature Classification: Automotive
• Mounting: Surface Mount
• Pin Count: 112
• Package Type: LQFP
• No. Of I/o's: 91
• Eeprom Memory Size: 4KB
• Ram Memory Size: 16KB
• Cpu Speed: 50MHz
• No. Of Timers: 3
• No. Of Pwm Channels: 8
• Digital Ic Case Style: LQFP
• Rohs Compliant: Yes
• Processor Series: S12XE
• Core: HCS12
• Data Bus Width: 16 bit
• Data Ram Size: 16 KB
• Maximum Clock Frequency: 50 MHz
• Number Of Programmable I/os: 91
• Number Of Timers: 25
• Maximum Operating Temperature: + 125 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWHCS12
• Development Tools By Supplier: KIT33812ECUEVME, EVB9S12XEP100, DEMO9S12XEP100
• Minimum Operating Temperature: - 40 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Chapter 11 S12XE Clocks and Reset Generator (S12XECRGV1)
11.3
This section provides a detailed description of all registers accessible in the S12XECRG.
11.3.1
Figure 11-2
474
2. FORBYP and CTCTL are intended for factory test purposes only.
Address
0x000A
0x000B
0x0000
0x0001
0x0002
0x0003
0x0004
0x0005
0x0006
0x0007
0x0008
0x0009
Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers
indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010
FORBYP
Memory Map and Registers
POSTDIV
ARMCOP
CRGFLG
COPCTL
CRGINT
CLKSEL
PLLCTL
CTCTL
RTICTL
REFDV
SYNR
Name
Module Memory Map
gives an overview on all S12XECRG registers.
Register Address = Base Address + Address Offset, where the Base Address
is defined at the MCU level and the Address Offset is defined at the module
level.
2
2
W
W
W
W
W
W
W
W
W
W
W
W
R
R
R
R
R
R
R
R
R
R
R
R
PLLSEL
RTDEC
WCOP
RTIE
CME
Bit 7
RTIF
Bit 7
VCOFRQ[1:0]
REFFRQ[1:0]
0
0
0
0
MC9S12XE-Family Reference Manual , Rev. 1.23
= Unimplemented or Reserved
RSBCK
Figure 11-2. CRG Register Summary
PLLON
PORF
PSTP
RTR6
Bit 6
6
0
0
0
0
0
WRTMASK
XCLKS
RTR5
LVRF
FM1
Bit 5
5
0
0
0
0
0
0
NOTE
LOCKIE
LOCKIF
RTR4
FM0
Bit 4
4
0
0
0
0
0
FSTWKP
PLLWAI
LOCK
RTR3
Bit 3
3
0
0
0
0
0
SYNDIV[5:0]
REFDIV[5:0]
POSTDIV[4:0]
RTR2
ILAF
PRE
CR2
Bit 2
2
0
0
0
0
0
Freescale Semiconductor
RTIWAI
SCMIF
SCMIE
RTR1
PCE
CR1
Bit 1
1
0
0
0
COPWAI
SCME
RTR0
SCM
Bit 0
CR0
Bit 0
0
0
0
0