MC9S12XET256MAL Freescale Semiconductor, MC9S12XET256MAL Datasheet - Page 1029
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MC9S12XET256MAL
Manufacturer Part Number
MC9S12XET256MAL
Description
MCU 16BIT 256K FLASH 112-LQFP
Manufacturer
Freescale Semiconductor
Series
HCS12r
Datasheet
1.MC9S12XEP768CAL.pdf
(1328 pages)
Specifications of MC9S12XET256MAL
Core Processor
HCS12X
Core Size
16-Bit
Speed
50MHz
Connectivity
CAN, EBI/EMI, I²C, IrDA, SCI, SPI
Peripherals
LVD, POR, PWM, WDT
Number Of I /o
91
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Eeprom Size
4K x 8
Ram Size
16K x 8
Voltage - Supply (vcc/vdd)
1.72 V ~ 5.5 V
Data Converters
A/D 12x12b
Oscillator Type
External
Operating Temperature
-40°C ~ 125°C
Package / Case
112-LQFP
Cpu Family
HCS12X
Device Core Size
16b
Frequency (max)
50MHz
Interface Type
CAN/SCI/SPI
Total Internal Ram Size
16KB
# I/os (max)
91
Number Of Timers - General Purpose
25
Operating Supply Voltage (typ)
1.8/2.8/5V
Operating Supply Voltage (max)
1.98/2.9/5.5V
Operating Supply Voltage (min)
1.72/2.7/3.13V
On-chip Adc
16-chx12-bit
Instruction Set Architecture
RISC
Operating Temp Range
-40C to 125C
Operating Temperature Classification
Automotive
Mounting
Surface Mount
Pin Count
112
Package Type
LQFP
No. Of I/o's
91
Eeprom Memory Size
4KB
Ram Memory Size
16KB
Cpu Speed
50MHz
No. Of Timers
3
No. Of Pwm Channels
8
Digital Ic Case Style
LQFP
Rohs Compliant
Yes
Processor Series
S12XE
Core
HCS12
Data Bus Width
16 bit
Data Ram Size
16 KB
Maximum Clock Frequency
50 MHz
Number Of Programmable I/os
91
Number Of Timers
25
Maximum Operating Temperature
+ 125 C
Mounting Style
SMD/SMT
3rd Party Development Tools
EWHCS12
Development Tools By Supplier
KIT33812ECUEVME, EVB9S12XEP100, DEMO9S12XEP100
Minimum Operating Temperature
- 40 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MC9S12XET256MAL
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
Part Number:
MC9S12XET256MAL
Manufacturer:
FREESCALE
Quantity:
20 000
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27.3.2.1
The FCLKDIV register is used to control timed events in program and erase algorithms.
All bits in the FCLKDIV register are readable, bits 6–0 are write once and bit 7 is not writable.
Freescale Semiconductor
FDIV[6:0]
FDIVLD
Address
Offset Module Base + 0x0000
Reset
& Name
Field
6–0
7
W
R
FDIVLD
Clock Divider Loaded
0 FCLKDIV register has not been written
1 FCLKDIV register has been written since the last reset
Clock Divider Bits — FDIV[6:0] must be set to effectively divide OSCCLK down to generate an internal Flash
clock, FCLK, with a target frequency of 1 MHz for use by the Flash module to control timed events during program
and erase algorithms.
Please refer to
Flash Clock Divider Register (FCLKDIV)
0
7
The FCLKDIV register should never be written while a Flash command is
executing (CCIF=0). The FCLKDIV register is writable during the Flash
reset sequence even though CCIF is clear.
= Unimplemented or Reserved
7
Section 27.4.1, “Flash Command Operations,”
Figure 27-4. FTM512K3 Register Summary (continued)
0
6
Figure 27-5. Flash Clock Divider Register (FCLKDIV)
= Unimplemented or Reserved
Table 27-9
MC9S12XE-Family Reference Manual , Rev. 1.23
6
Table 27-8. FCLKDIV Field Descriptions
0
5
shows recommended values for FDIV[6:0] based on OSCCLK frequency.
5
CAUTION
0
4
Description
4
FDIV[6:0]
Chapter 27 512 KByte Flash Module (S12XFTM512K3V1)
0
3
for more information.
3
0
2
2
0
1
1
0
0
0
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